Lapped substrate for enhanced backsurface reflectivity in a thermophotovoltaic energy conversion system
Description:
A method is described for fabricating a thermophotovoltaic energy conversion cell including a thin semiconductor wafer substrate having a thickness ({beta}) calculated to decrease the free carrier absorption on a heavily doped substrate; wherein the top surface of the semiconductor wafer substrate is provided with a thermophotovoltaic device, a metallized grid and optionally an antireflective (AR) overcoating; and, the bottom surface (10 ft) of the semiconductor wafer substrate is provided with…
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Date:
December 31, 1996
Creator:
Baldasaro, Paul F.; Brown, Edward J.; Charache, Greg W. & DePoy, David M.
Partner:
UNT Libraries Government Documents Department