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A Wet Etch Release Method for Silicon Microelectromechanical Systems (MEMS) Using Polystyrene Microspheres for Improved Yield

Description: One of the final steps in fabricating microelectromechanical devices often involves a liquid etch release process. Capillary forces during the liquid evaporation stage after the wet etch process can pull two surfaces together resulting in adhesion of suspended microstructures to the supporting substrate. This release related adhesion can greatly reduce yields. In this report, a wet etch release method that uses polystyrene microspheres in the final rinse liquid is investigated. The polystyrene … more
Date: May 2004
Creator: Mantiziba, Fadziso
Item Type: Refine your search to only Thesis or Dissertation
Partner: UNT Libraries

Processing-Structure-Property Relationships of Reactive Spark Plasma Sintered Boron Carbide-Titanium Diboride Composites

Description: Sintering parameter effects on the microstructure of boron carbide and boron carbide/titanium diboride composites are investigated. The resulting microstructure and composition are characterized by scanning electron microscopy (SEM), x-ray microscopy (XRM) and x-ray diffraction (XRD). Starting powder size distribution effects on microstructure are present and effect the mechanical properties. Reactive spark plasma sintering introduces boron nitride (BN) intergranular films (IGF's) and their eff… more
Date: August 2019
Creator: Lide, Hunter
Item Type: Refine your search to only Thesis or Dissertation
Partner: UNT Libraries
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