D0 Silicon Upgrade: Thermally Induced Stresses in the Components of a D0 Ladder in the Silicon Tracker
Description:
During the operation of the silicon tracker, the ladders will be in direct thermal contact with a cooling channel. The expected operating temperature of the cooling channel is 0 C, maintained by a cooling fluid whose bulk temperature is below 0 C. The assembly temperature is assumed to be 22 C. Due to the mis-match of material expansion coefficients, thermal stresses will be induced in the epoxy, beryllium, and silicon of the ladders. Calculations are presented here as well as some thermal cycl…
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Date:
July 2, 1996
Creator:
Ratzmann, Paul M.
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