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The Interactions of Plasma with Low-k Dielectrics: Fundamental Damage and Protection Mechanisms

Description: Nanoporous low-k dielectrics are used for integrated circuit interconnects to reduce the propagation delays, and cross talk noise between metal wires as an alternative material for SiO2. These materials, typically organosilicate glass (OSG) films, are exposed to oxygen plasmas during photoresist stripping and related processes which substantially damage the film by abstracting carbon, incorporating O and OH, eventually leading to significantly increased k values. Systematic studies have been … more
Date: August 2011
Creator: Behera, Swayambhu Prasad
Partner: UNT Libraries
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