Synchrotron X-Ray Microdiffraction Studies of Electromigration in Interconnect lines at the Advanced Light Source

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Synchrotron polychromatic X-ray microdiffraction is a particularly suitable technique to study in situ the effect of electromigration in metal interconnects as add spatial resolution to grain orientation and strain sensitivity. This technique has been extensively used at the Advanced Light Source to monitor changes in aluminum and copper interconnect test structures while high-density current is passed into them during accelerated tests at elevated temperature. One of the principal findings is the observation of electromigration-induced plasticity in the metal lines that appear during the very early stages of electromigration. In some of the lines, high density of geometrically necessary dislocation are ... continued below

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Tamura, Nobumichi; Chen, Kai & Kunz, Martin May 1, 2009.

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Synchrotron polychromatic X-ray microdiffraction is a particularly suitable technique to study in situ the effect of electromigration in metal interconnects as add spatial resolution to grain orientation and strain sensitivity. This technique has been extensively used at the Advanced Light Source to monitor changes in aluminum and copper interconnect test structures while high-density current is passed into them during accelerated tests at elevated temperature. One of the principal findings is the observation of electromigration-induced plasticity in the metal lines that appear during the very early stages of electromigration. In some of the lines, high density of geometrically necessary dislocation are formed leading to additional diffusion paths causing an enhancement of electromigration effect at test temperature. This paper presents an overview of the principal results obtained from X-ray microdiffraction studies of electromigration effects on aluminum and copper interconnects at the ALS throughout continuous efforts that spanned over a decade (1998-2008) from approximately 40 weeks of combined beamtime.

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  • 10th International Workshop on Stress-Induced Phenomena in Metallization, Austin, TX, November 5-7, 2008

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  • Report No.: LBNL-1955E
  • Grant Number: DE-AC02-05CH11231
  • Office of Scientific & Technical Information Report Number: 961530
  • Archival Resource Key: ark:/67531/metadc932405

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  • May 1, 2009

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  • Nov. 13, 2016, 7:26 p.m.

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  • Jan. 4, 2017, 3:55 p.m.

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Tamura, Nobumichi; Chen, Kai & Kunz, Martin. Synchrotron X-Ray Microdiffraction Studies of Electromigration in Interconnect lines at the Advanced Light Source, article, May 1, 2009; Berkeley, California. (digital.library.unt.edu/ark:/67531/metadc932405/: accessed June 23, 2018), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.