In-situ study of electromigration-induced grain rotation in Pb-free solder joint by synchrotron microdiffraction

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The rotation of Sn grains in Pb-free flip chip solder joints hasn't been reported in literature so far although it has been observed in Sn strips. In this letter, we report the detailed study of the grain orientation evolution induced by electromigration by synchrotron based white beam X-ray microdiffraction. It is found that the grains in solder joint rotate more slowly than in Sn strip even under higher current density. On the other hand, based on our estimation, the reorientation of the grains in solder joints also results in the reduction of electric resistivity, similar to the case of Sn ... continued below

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Chen, Kai; Tamura, Nobumichi & Tu, King-Ning October 31, 2008.

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The rotation of Sn grains in Pb-free flip chip solder joints hasn't been reported in literature so far although it has been observed in Sn strips. In this letter, we report the detailed study of the grain orientation evolution induced by electromigration by synchrotron based white beam X-ray microdiffraction. It is found that the grains in solder joint rotate more slowly than in Sn strip even under higher current density. On the other hand, based on our estimation, the reorientation of the grains in solder joints also results in the reduction of electric resistivity, similar to the case of Sn strip. We will also discuss the reason why the electric resistance decreases much more in strips than in the Sn-based solders, and the different driving force for the grain growth in solder joint and in thin film interconnect lines.

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  • Materials Research Society 2008 Fall Meeting

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  • Report No.: LBNL-1769E
  • Grant Number: DE-AC02-05CH11231
  • Office of Scientific & Technical Information Report Number: 951957
  • Archival Resource Key: ark:/67531/metadc930176

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  • October 31, 2008

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  • Nov. 13, 2016, 7:26 p.m.

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  • Jan. 4, 2017, 3:34 p.m.

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Chen, Kai; Tamura, Nobumichi & Tu, King-Ning. In-situ study of electromigration-induced grain rotation in Pb-free solder joint by synchrotron microdiffraction, article, October 31, 2008; Berkeley, California. (digital.library.unt.edu/ark:/67531/metadc930176/: accessed October 23, 2018), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.