Electromigration-induced Plasticity: Texture Correlation and Implications for Reliability Assessment

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Plastic behavior has previously been observed in metallic interconnects undergoing high current density electromigration (EM) loading. In this study of Cu interconnects, using the synchrotron technique of white beam X-ray microdiffraction, we have further found preliminary evidence of a texture correlation. In lines with strong (111) textures, the extent of plastic deformation is found to be relatively large compared to that of weaker textures. We suggest that this strong (111) texture may lead to an extra path of mass transport in addition to the dominant interface diffusion in Cu EM. When this extra mass transport begins to affect the overall ... continued below

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Budiman, A.S.; Besser, P.R.; Hau-Riege, C.S.; Marathe, A.; Joo, Y.-C.; Tamura, N. et al. May 29, 2008.

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Plastic behavior has previously been observed in metallic interconnects undergoing high current density electromigration (EM) loading. In this study of Cu interconnects, using the synchrotron technique of white beam X-ray microdiffraction, we have further found preliminary evidence of a texture correlation. In lines with strong (111) textures, the extent of plastic deformation is found to be relatively large compared to that of weaker textures. We suggest that this strong (111) texture may lead to an extra path of mass transport in addition to the dominant interface diffusion in Cu EM. When this extra mass transport begins to affect the overall transport process, then the effective diffusivity, D{sub eff}, of the EM process is expected to deviate from that of interface diffusion only. This would have fundamental implications. We have some preliminary observations that this might be the case, and we report its implications for EM lifetime assessment in this manuscript.

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  • Journal Name: Journal of Electronic Materials

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  • Report No.: LBNL-1766E
  • Grant Number: DE-AC02-05CH11231
  • Office of Scientific & Technical Information Report Number: 951955
  • Archival Resource Key: ark:/67531/metadc928396

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  • May 29, 2008

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  • Nov. 13, 2016, 7:26 p.m.

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  • Jan. 4, 2017, 3:33 p.m.

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Budiman, A.S.; Besser, P.R.; Hau-Riege, C.S.; Marathe, A.; Joo, Y.-C.; Tamura, N. et al. Electromigration-induced Plasticity: Texture Correlation and Implications for Reliability Assessment, article, May 29, 2008; Berkeley, California. (digital.library.unt.edu/ark:/67531/metadc928396/: accessed July 18, 2018), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.