An aluminum resist substrate for microfabrication by LIGA.

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Description

Resist substrates used in the LIGA process must provide high initial bond strength between the substrate and resist, little degradation of the bond strength during x-ray exposure, acceptable undercut rates during development, and a surface enabling good electrodeposition of metals. Additionally, they should produce little fluorescence radiation and give small secondary doses in bright regions of the resist at the substrate interface. To develop a new substrate satisfying all these requirements, we have investigated secondary resist doses due to electrons and fluorescence, resist adhesion before exposure, loss of fine features during extended development, and the nucleation and adhesion of electrodeposits ... continued below

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26 p.

Creation Information

Kelly, James J.; Boehme, Dale R.; Hauck, Cheryl A. (Lawrence Berkeley National Laboratory, Berkeley, CA); Yang, Chu-Yeu Peter; Hunter, Luke L.; Griffiths, Stewart K. et al. April 1, 2005.

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Description

Resist substrates used in the LIGA process must provide high initial bond strength between the substrate and resist, little degradation of the bond strength during x-ray exposure, acceptable undercut rates during development, and a surface enabling good electrodeposition of metals. Additionally, they should produce little fluorescence radiation and give small secondary doses in bright regions of the resist at the substrate interface. To develop a new substrate satisfying all these requirements, we have investigated secondary resist doses due to electrons and fluorescence, resist adhesion before exposure, loss of fine features during extended development, and the nucleation and adhesion of electrodeposits for various substrate materials. The result of these studies is a new anodized aluminum substrate and accompanying methods for resist bonding and electrodeposition. We demonstrate successful use of this substrate through all process steps and establish its capabilities via the fabrication of isolated resist features down to 6 {micro}m, feature aspect ratios up to 280 and electroformed nickel structures at heights of 190 to 1400 {micro}m. The minimum mask absorber thickness required for this new substrate ranges from 7 to 15 {micro}m depending on the resist thickness.

Physical Description

26 p.

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  • Report No.: SAND2005-2521
  • Grant Number: AC04-94AL85000
  • DOI: 10.2172/923166 | External Link
  • Office of Scientific & Technical Information Report Number: 923166
  • Archival Resource Key: ark:/67531/metadc898399

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Creation Date

  • April 1, 2005

Added to The UNT Digital Library

  • Sept. 27, 2016, 1:39 a.m.

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  • Dec. 2, 2016, 7:16 p.m.

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Kelly, James J.; Boehme, Dale R.; Hauck, Cheryl A. (Lawrence Berkeley National Laboratory, Berkeley, CA); Yang, Chu-Yeu Peter; Hunter, Luke L.; Griffiths, Stewart K. et al. An aluminum resist substrate for microfabrication by LIGA., report, April 1, 2005; United States. (digital.library.unt.edu/ark:/67531/metadc898399/: accessed January 22, 2018), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.