Harsh-Environment Packaging for Downhole Gas and Oil Exploration

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Description

This research into new packaging materials and methods for elevated temperatures and harsh environment electronics focused on gaining a basic understanding of current state-of-the-art in electronics packaging used in industry today, formulating the thermal-mechanical models of the material interactions and developing test structures to confirm these models. Discussions were initiated with the major General Electric (GE) businesses that currently sell into markets requiring high temperature electronics and packaging. They related the major modes of failure they encounter routinely and the hurdles needed to be overcome in order to improve the temperature specifications of these products. We consulted with our GE ... continued below

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Bansal, Shubhra; Cho, Junghyun; Durocher, Kevin; Kapusta, Chris; Knobloch, Aaron; Shaddock, David et al. August 31, 2007.

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Description

This research into new packaging materials and methods for elevated temperatures and harsh environment electronics focused on gaining a basic understanding of current state-of-the-art in electronics packaging used in industry today, formulating the thermal-mechanical models of the material interactions and developing test structures to confirm these models. Discussions were initiated with the major General Electric (GE) businesses that currently sell into markets requiring high temperature electronics and packaging. They related the major modes of failure they encounter routinely and the hurdles needed to be overcome in order to improve the temperature specifications of these products. We consulted with our GE business partners about the reliability specifications and investigated specifications and guidelines that from IPC and the SAE body that is currently developing guidelines for electronics package reliability. Following this, a risk analysis was conducted for the program to identify the critical risks which need to be mitigated in order to demonstrate a flex-based packaging approach under these conditions. This process identified metal/polyimide adhesion, via reliability for flex substrates and high temperature interconnect as important technical areas for reliability improvement.

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  • Report No.: None
  • Grant Number: FC26-06NT42950
  • DOI: 10.2172/932889 | External Link
  • Office of Scientific & Technical Information Report Number: 932889
  • Archival Resource Key: ark:/67531/metadc896470

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Creation Date

  • August 31, 2007

Added to The UNT Digital Library

  • Sept. 27, 2016, 1:39 a.m.

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  • Nov. 28, 2016, 7:40 p.m.

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Bansal, Shubhra; Cho, Junghyun; Durocher, Kevin; Kapusta, Chris; Knobloch, Aaron; Shaddock, David et al. Harsh-Environment Packaging for Downhole Gas and Oil Exploration, report, August 31, 2007; United States. (digital.library.unt.edu/ark:/67531/metadc896470/: accessed September 23, 2017), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.