Electrical properties of REF308, REF320, EF-AR20, and RSF200 foam encapsulants.

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Foam encapsulants are used to encapsulate electromechanical assemblies for reasons such as shock mitigation, structural support, and voltage breakdown protection. Characterization of electrical properties of polymer encapsulants is important in situations where potting materials are in intimate contact with electrical components (e.g., printed wiring boards). REF308, REF320, RSF200, and EF-AR20 foams were developed for encapsulation in some potting applications at Sandia. Select electrical properties were measured for these Sandia encapsulants to characterize them for use in electromechanical potting applications. Dielectric constant with dissipation factors, volume resistivity, and dielectric strength were measured for REF308, REF320, RSF200, and EF-AR20 encapsulants. Fabrication of ... continued below

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13p.

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Russick, Edward Mark January 1, 2006.

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This report is part of the collection entitled: Office of Scientific & Technical Information Technical Reports and was provided by UNT Libraries Government Documents Department to Digital Library, a digital repository hosted by the UNT Libraries. It has been viewed 28 times , with 21 in the last month . More information about this report can be viewed below.

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Description

Foam encapsulants are used to encapsulate electromechanical assemblies for reasons such as shock mitigation, structural support, and voltage breakdown protection. Characterization of electrical properties of polymer encapsulants is important in situations where potting materials are in intimate contact with electrical components (e.g., printed wiring boards). REF308, REF320, RSF200, and EF-AR20 foams were developed for encapsulation in some potting applications at Sandia. Select electrical properties were measured for these Sandia encapsulants to characterize them for use in electromechanical potting applications. Dielectric constant with dissipation factors, volume resistivity, and dielectric strength were measured for REF308, REF320, RSF200, and EF-AR20 encapsulants. Fabrication of foam test specimens and the electrical test procedures will be discussed, and electrical testing results will be reported.

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13p.

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  • Report No.: SAND2006-0134
  • Grant Number: AC04-94AL85000
  • DOI: 10.2172/883468 | External Link
  • Office of Scientific & Technical Information Report Number: 883468
  • Archival Resource Key: ark:/67531/metadc891547

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Office of Scientific & Technical Information Technical Reports

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  • January 1, 2006

Added to The UNT Digital Library

  • Sept. 23, 2016, 2:42 p.m.

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  • Nov. 23, 2016, 5:46 p.m.

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Russick, Edward Mark. Electrical properties of REF308, REF320, EF-AR20, and RSF200 foam encapsulants., report, January 1, 2006; United States. (https://digital.library.unt.edu/ark:/67531/metadc891547/: accessed May 26, 2019), University of North Texas Libraries, Digital Library, https://digital.library.unt.edu; crediting UNT Libraries Government Documents Department.