Hygroscopic Fine Mode Particle Deposition on Electronic Circuitsand Resulting Degradation of Circuit Performance: An ExperimentalStudy

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A portion of electronic equipment failures is a consequenceof particle deposition on electronic circuits in normal indoorenvironments. Deposited hygroscopic particles reduce the electricalisolation (EI) between conductors. In laboratory experiments, weinvestigated the mechanisms, locations, and effects of particledeposition on electronic circuits with surface mounted chips (SMCs) andalso on small television sets. One set of electronics was exposed for 281h to an unusually high concentration of artificially-generated ammoniumsulfate particles while a second set (experimental controls) was exposedto normal indoor particles. The particle mass concentration in thehigh-exposure chamber was 500 times higher than normal. Televisionreliability was observed and the changes in EI between ... continued below

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Litvak, Andres; Gadgil, A. & Fisk, W.J. March 1, 1998.

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A portion of electronic equipment failures is a consequenceof particle deposition on electronic circuits in normal indoorenvironments. Deposited hygroscopic particles reduce the electricalisolation (EI) between conductors. In laboratory experiments, weinvestigated the mechanisms, locations, and effects of particledeposition on electronic circuits with surface mounted chips (SMCs) andalso on small television sets. One set of electronics was exposed for 281h to an unusually high concentration of artificially-generated ammoniumsulfate particles while a second set (experimental controls) was exposedto normal indoor particles. The particle mass concentration in thehigh-exposure chamber was 500 times higher than normal. Televisionreliability was observed and the changes in EI between adjacent legs ofSMCs were measured. The experiments demonstrate the strong influence ofelectrostatic forces on the locations and rates of particle deposition.Although televisions did not fail after exposure to concentratedaerosols, the EI between adjacent legs of the SMCs was, in many cases,greatly diminished. Relative humidity had a very strong influence on themagnitude of EI. A qualitative explanation of the mechanisms of particledeposition and circuit degradation is proposed, including the role offibers. Finally, a potential method to reduce particle deposition onelectronic components is discussed.

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  • Journal Name: Indoor Air; Journal Volume: 10; Journal Issue: 1; Related Information: Journal Publication Date: 03/2000

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  • Report No.: LBNL--41315
  • Grant Number: DE-AC02-05CH11231
  • Office of Scientific & Technical Information Report Number: 903021
  • Archival Resource Key: ark:/67531/metadc891449

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Office of Scientific & Technical Information Technical Reports

Reports, articles and other documents harvested from the Office of Scientific and Technical Information.

Office of Scientific and Technical Information (OSTI) is the Department of Energy (DOE) office that collects, preserves, and disseminates DOE-sponsored research and development (R&D) results that are the outcomes of R&D projects or other funded activities at DOE labs and facilities nationwide and grantees at universities and other institutions.

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  • March 1, 1998

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  • Sept. 22, 2016, 2:13 a.m.

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  • Nov. 30, 2017, 9:08 p.m.

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Litvak, Andres; Gadgil, A. & Fisk, W.J. Hygroscopic Fine Mode Particle Deposition on Electronic Circuitsand Resulting Degradation of Circuit Performance: An ExperimentalStudy, article, March 1, 1998; Berkeley, California. (digital.library.unt.edu/ark:/67531/metadc891449/: accessed December 14, 2017), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.