Adhesion and Thin-Film Module Reliability: Preprint

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Among the infrequently measured but essential properties for thin-film (T-F) module reliability are the interlayer adhesion and cohesion within a layer. These can be cell contact layers to glass, contact layers to the semiconductor, encapsulant to cell, glass, or backsheet, etc. We use an Instron mechanical testing unit to measure peel strengths at 90{sup o} or 180{sup o} and, in some cases, a scratch and tape pull test to evaluate inter-cell layer adhesion strengths. We present peel strength data for test specimens laminated from the three T-F technologies, before and after damp heat, and in one instance at elevated temperatures. ... continued below

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6 p.

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McMahon, T. J. & Jorgensen, G. J. May 1, 2006.

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Description

Among the infrequently measured but essential properties for thin-film (T-F) module reliability are the interlayer adhesion and cohesion within a layer. These can be cell contact layers to glass, contact layers to the semiconductor, encapsulant to cell, glass, or backsheet, etc. We use an Instron mechanical testing unit to measure peel strengths at 90{sup o} or 180{sup o} and, in some cases, a scratch and tape pull test to evaluate inter-cell layer adhesion strengths. We present peel strength data for test specimens laminated from the three T-F technologies, before and after damp heat, and in one instance at elevated temperatures. On laminated T-F cell samples, failure can occur uniformly at any one of the many interfaces, or non-uniformly across the peel area at more than one interface. Some peel strengths are << 1 N/mm. This is far below the normal Instron mechanical testing unit Instron mechanical testing unit; glass interface values of >10 N/mm. We measure a wide range of adhesion strengths and suggest that adhesion measured under higher temperature and relative humidity conditions is more relevant for module reliability.

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6 p.

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  • Presented at the 2006 IEEE 4th World Conference on Photovoltaic Energy Conversion (WCPEC-4), 7-12 May 2006, Waikoloa, Hawaii

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  • Report No.: NREL/CP-520-39732
  • Grant Number: AC36-99-GO10337
  • Office of Scientific & Technical Information Report Number: 891468
  • Archival Resource Key: ark:/67531/metadc884163

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  • May 1, 2006

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  • Sept. 21, 2016, 2:29 a.m.

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  • April 6, 2017, 12:49 p.m.

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McMahon, T. J. & Jorgensen, G. J. Adhesion and Thin-Film Module Reliability: Preprint, article, May 1, 2006; Golden, Colorado. (digital.library.unt.edu/ark:/67531/metadc884163/: accessed August 20, 2017), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.