Direct Observations of Rapid Diffusion of Cu in Au Thin Films using In-Situ X-ray Diffraction Metadata

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Title

  • Main Title Direct Observations of Rapid Diffusion of Cu in Au Thin Films using In-Situ X-ray Diffraction

Creator

  • Author: Elmer, J W
    Creator Type: Personal
  • Author: Palmer, T A
    Creator Type: Personal
  • Author: Specht, E D
    Creator Type: Personal

Contributor

  • Sponsor: United States. Department of Energy.
    Contributor Type: Organization

Publisher

  • Name: Lawrence Livermore National Laboratory
    Place of Publication: Livermore, California
    Additional Info: Lawrence Livermore National Laboratory (LLNL), Livermore, CA

Date

  • Creation: 2005-11-28

Language

  • English

Description

  • Content Description: In-situ x-ray diffraction was performed while annealing thin-film Au/Cu binary diffusion couples to directly observe diffusion at elevated temperatures. The temperature dependence of the interdiffusion coefficient was determined from isothermal measurements at 700 C, 800 C, and 900 C, where Cu and Au form a disordered continuous face centered cubic solid solution. Large differences in the lattice parameters of Au and Cu allowed the initial diffraction peaks to be easily identified, and later tracked as they merged into one diffraction peak with increased diffusion time. Initial diffusion kinetics were studied by measuring the time required for the Cu to diffuse through the Au thin film of known thickness. The activation energy for interdiffusion was measured to be 65.4 kJ/mole during this initial stage, which is approximately 0.4x that for bulk diffusion and 0.8x that for grain boundary diffusion. The low activation energy is attributed to the high density of columnar grain boundaries combined with other defects in the sputter deposited thin film coatings. As interdiffusion continues, the two layers homogenize with an activation energy of 111 kJ/mole during the latter stages of diffusion. This higher activation energy falls between the reported values for grain boundary and bulk diffusion, and may be related to grain growth occurring at these temperatures which accounts for the decreasing importance of grain boundaries on diffusion.
  • Physical Description: PDF-file: 35 pages; size: 1.4 Mbytes

Subject

  • Keyword: Diffraction
  • Keyword: X-Ray Diffraction
  • Keyword: Lattice Parameters
  • Keyword: Thickness
  • STI Subject Categories: 36 Materials Science
  • Keyword: Fcc Lattices
  • Keyword: Kinetics
  • Keyword: Grain Growth
  • Keyword: Thin Films
  • Keyword: Annealing
  • Keyword: Temperature Dependence
  • Keyword: Diffusion
  • Keyword: Grain Boundaries
  • Keyword: Defects
  • Keyword: Coatings
  • Keyword: Solid Solutions
  • Keyword: Activation Energy

Source

  • Journal Name: Journal of Vacuum Science and Technology - A, vol. 24(4), N/A, July 1, 2006, pp. 978-987

Collection

  • Name: Office of Scientific & Technical Information Technical Reports
    Code: OSTI

Institution

  • Name: UNT Libraries Government Documents Department
    Code: UNTGD

Resource Type

  • Article

Format

  • Text

Identifier

  • Report No.: UCRL-JRNL-217421
  • Grant Number: W-7405-ENG-48
  • Office of Scientific & Technical Information Report Number: 898025
  • Archival Resource Key: ark:/67531/metadc879360