Sputter deposition of metallic thin film and directpatterning

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A compact apparatus is developed for deposition of metal thin film. The system employs an RF discharge plasma source with a straight RF antenna, which is made of or covered with deposition material, serving as sputtering target at the same time. The average deposition rate of copper thin film is as high as 450nm/min. By properly allocating the metal materials on the sputtering antenna, mixture deposition of multiple metal species is achieved. Using an ion beam imprinting scheme also taking advantage of ion beam focusing technique, two different schemes of direct patterning deposition process are developed: direct depositing patterned metallic ... continued below

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Ji, L.; Chen, Y.; Jiang, X.; Ji, Q. & Leung, K.-N. September 9, 2005.

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Description

A compact apparatus is developed for deposition of metal thin film. The system employs an RF discharge plasma source with a straight RF antenna, which is made of or covered with deposition material, serving as sputtering target at the same time. The average deposition rate of copper thin film is as high as 450nm/min. By properly allocating the metal materials on the sputtering antenna, mixture deposition of multiple metal species is achieved. Using an ion beam imprinting scheme also taking advantage of ion beam focusing technique, two different schemes of direct patterning deposition process are developed: direct depositing patterned metallic thin film and resistless ion beam sputter patterning. Preliminary experiments have demonstrated direct pattern transfer from a template with feature size of micro scale; patterns with more than 10x reduction are achieved by sputtering patterning method.

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  • 49th International conference on electron, ion,photon beam technology and nanofabrication, Orlando, Florida, May 31-June3, 2005

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  • Report No.: LBNL--58790
  • Grant Number: DE-AC02-05CH11231
  • Office of Scientific & Technical Information Report Number: 878122
  • Archival Resource Key: ark:/67531/metadc876437

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Office of Scientific & Technical Information Technical Reports

Reports, articles and other documents harvested from the Office of Scientific and Technical Information.

Office of Scientific and Technical Information (OSTI) is the Department of Energy (DOE) office that collects, preserves, and disseminates DOE-sponsored research and development (R&D) results that are the outcomes of R&D projects or other funded activities at DOE labs and facilities nationwide and grantees at universities and other institutions.

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  • September 9, 2005

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  • Sept. 21, 2016, 2:29 a.m.

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  • Dec. 9, 2016, 10:28 p.m.

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Ji, L.; Chen, Y.; Jiang, X.; Ji, Q. & Leung, K.-N. Sputter deposition of metallic thin film and directpatterning, article, September 9, 2005; Berkeley, California. (digital.library.unt.edu/ark:/67531/metadc876437/: accessed April 20, 2018), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.