MCU MATERIALS COMPATIBILITY WITH CSSX SOLVENT

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The Modular Caustic-Side Solvent Extraction (CSSX) Unit (MCU) plans to use several new materials of construction not previously used with CSSX solvent. SRNL researchers tested seven materials proposed for service in seal and gasket applications. None of the materials leached detectable amounts of components into the CSSX solvent during 96 hour tests. All are judged acceptable for use based on their effect on the solvent. However, some of the materials adsorbed solvent or changed dimensions during contact with solvent. Consultation with component and material vendors with regard to performance impact and in-use testing of the materials is recommended. Polyetheretherketone (PEEK), ... continued below

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Fondeur, F January 13, 2006.

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The Modular Caustic-Side Solvent Extraction (CSSX) Unit (MCU) plans to use several new materials of construction not previously used with CSSX solvent. SRNL researchers tested seven materials proposed for service in seal and gasket applications. None of the materials leached detectable amounts of components into the CSSX solvent during 96 hour tests. All are judged acceptable for use based on their effect on the solvent. However, some of the materials adsorbed solvent or changed dimensions during contact with solvent. Consultation with component and material vendors with regard to performance impact and in-use testing of the materials is recommended. Polyetheretherketone (PEEK), a material selected for use in contactor bearing seals, did not gain weight or change dimensions on contact with CSSX solvent. Analysis of the solvent contacted with this material showed no impurities and the standard dispersion test gave acceptable phase separation results. The material contains a leachable hydrocarbon substance, detectable on exposed surfaces, that did not adversely contaminate the solvent within the limits of the testing. We recommend contacting the vendor to determine the source and purpose of this component, or, alternatively, pursue the infrared analysis of the PEEK in an effort to better define potential impacts.

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  • Report No.: WSRC-TR-2005-00577
  • Grant Number: DE-AC09-96SR18500
  • DOI: 10.2172/890208 | External Link
  • Office of Scientific & Technical Information Report Number: 890208
  • Archival Resource Key: ark:/67531/metadc876335

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  • January 13, 2006

Added to The UNT Digital Library

  • Sept. 21, 2016, 2:29 a.m.

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  • Nov. 2, 2016, 3:40 p.m.

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Fondeur, F. MCU MATERIALS COMPATIBILITY WITH CSSX SOLVENT, report, January 13, 2006; [Aiken, South Carolina]. (digital.library.unt.edu/ark:/67531/metadc876335/: accessed September 25, 2017), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.