Electrodeposition of nickel from low temperature sulfamate electrolytes.Part 1 :Electrochemistry and film stress.

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The film stress of Ni films deposited at near-ambient temperatures from sulfamate electrolytes was studied. The particulate filtering of the electrolyte, a routine industrial practice, becomes an important deposition parameter at lower bath temperatures. At 28 C, elevated tensile film stress develops at low current densities (<10 mA/cm{sup 2}) if the electrolyte is filtered. Filtering at higher current densities has a negligible effect on film stress. A similar though less pronounced trend is observed at 32 C. Sulfate-based Ni plating baths display similar film stress sensitivity to filtering, suggesting that this is a general effect for Ni electrodeposition. It is ... continued below

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62 p.

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Hachman, John T.; Kelly, J.J. (IBM/T.J. Watson Research Center, Yorktown Heights, NY); Talin, Albert Alec & Goods, Steven Howard November 1, 2005.

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The film stress of Ni films deposited at near-ambient temperatures from sulfamate electrolytes was studied. The particulate filtering of the electrolyte, a routine industrial practice, becomes an important deposition parameter at lower bath temperatures. At 28 C, elevated tensile film stress develops at low current densities (<10 mA/cm{sup 2}) if the electrolyte is filtered. Filtering at higher current densities has a negligible effect on film stress. A similar though less pronounced trend is observed at 32 C. Sulfate-based Ni plating baths display similar film stress sensitivity to filtering, suggesting that this is a general effect for Ni electrodeposition. It is shown that filtering does not significantly change the current efficiency or the pH near the surface during deposition. The observed changes in film stress are thus attributed not to adsorbed hydrogen but instead to the effects of filtering on the formation and concentration of polyborate species due to the decreased solubility of boric acid at near-ambient temperatures.

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62 p.

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  • Report No.: SAND2005-6077
  • Grant Number: AC04-94AL85000
  • DOI: 10.2172/875966 | External Link
  • Office of Scientific & Technical Information Report Number: 875966
  • Archival Resource Key: ark:/67531/metadc875993

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  • November 1, 2005

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  • Sept. 21, 2016, 2:29 a.m.

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  • Nov. 23, 2016, 6:02 p.m.

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Hachman, John T.; Kelly, J.J. (IBM/T.J. Watson Research Center, Yorktown Heights, NY); Talin, Albert Alec & Goods, Steven Howard. Electrodeposition of nickel from low temperature sulfamate electrolytes.Part 1 :Electrochemistry and film stress., report, November 1, 2005; United States. (digital.library.unt.edu/ark:/67531/metadc875993/: accessed April 19, 2018), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.