Search for Mechanically-Induced Grain Morphology Changes in Oxygen Free Electrolytic (OFE) Copper

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The deformation of the microscopic, pure metal grains (0.1 to > 1 millimeter) in the copper cells of accelerator structures decreases the power handling capabilities of the structures. The extent of deformation caused by mechanical fabrication damage is the focus of this study. Scanning electron microscope (SEM) imaging of a bonded test stack of six accelerating cells at magnifications of 30, 100, 1000 were taken before simulated mechanical damage was done. After a 2{sup o}-3{sup o} twist was manually applied to the test stack, the cells were cut apart and SEM imaged separately at the same set magnifications (30, 100, ... continued below

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17 pages

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Sanders, Jennifer & /SLAC August 18, 2006.

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The deformation of the microscopic, pure metal grains (0.1 to > 1 millimeter) in the copper cells of accelerator structures decreases the power handling capabilities of the structures. The extent of deformation caused by mechanical fabrication damage is the focus of this study. Scanning electron microscope (SEM) imaging of a bonded test stack of six accelerating cells at magnifications of 30, 100, 1000 were taken before simulated mechanical damage was done. After a 2{sup o}-3{sup o} twist was manually applied to the test stack, the cells were cut apart and SEM imaged separately at the same set magnifications (30, 100, and 1000), to examine any effects of the mechanical stress. Images of the cells after the twist were compared to the images of the stack end (cell 60) before the twist. Despite immense radial damage to the end cell from the process of twisting, SEM imaging showed no change in grain morphology from images taken before the damage: copper grains retained shape and the voids at the grain boundaries stay put. Likewise, the inner cells of the test stack showed similar grain consistency to that of the end cell before the twist was applied. Hence, there is no mechanical deformation observed on grains in the aperture disk, either for radial stress or for rotational stress. Furthermore, the high malleability of copper apparently absorbed stress and strain very well without deforming the grain structure in the surface.

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17 pages

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  • Journal Name: DOE Journal of Undergraduate Research

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  • Report No.: SLAC-TN-06-008
  • Grant Number: AC02-76SF00515
  • Office of Scientific & Technical Information Report Number: 889664
  • Archival Resource Key: ark:/67531/metadc874711

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  • August 18, 2006

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  • Sept. 21, 2016, 2:29 a.m.

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  • Dec. 1, 2016, 6:59 p.m.

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Sanders, Jennifer & /SLAC. Search for Mechanically-Induced Grain Morphology Changes in Oxygen Free Electrolytic (OFE) Copper, article, August 18, 2006; [Menlo Park, California]. (digital.library.unt.edu/ark:/67531/metadc874711/: accessed August 21, 2017), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.