Processing of alumina-niobium interfaces via liquid-film-assistedjoining Metadata

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Title

  • Main Title Processing of alumina-niobium interfaces via liquid-film-assistedjoining

Creator

  • Author: McKeown, Joseph T.
    Creator Type: Personal
  • Author: Sugar, Joshua D.
    Creator Type: Personal
  • Author: Gronsky, Ronald
    Creator Type: Personal
  • Author: Glaeser,Andreas M.
    Creator Type: Personal

Contributor

  • Sponsor: USDOE Director. Office of Science. Office of Basic EnergySciences. Materials Sciences and Engineering Division
    Contributor Type: Organization

Publisher

  • Name: Lawrence Berkeley National Laboratory
    Place of Publication: Berkeley, California
    Additional Info: "Ernest Orlando Lawrence Berkeley National Laboratory, Berkeley, CA (United States)"

Date

  • Creation: 2005-02-15

Language

  • English

Description

  • Content Description: Alumina-niobium interfaces were fabricated at 1400 C via solid-state diffusion brazing of a 127-{micro}m-thick niobium foil between alumina blocks. Prior to brazing, some of the alumina mating surfaces, both polished and unpolished, were evaporation-coated with copper films {approx}1.4 {micro}m, {approx}3.0 {micro}m, and {approx}5.5 {micro}m thick to induce liquid-film-assisted joining at the brazing temperature. The effects of copper film thickness and surface roughness on fracture characteristics and ceramic-metal interfacial microstructure were investigated by room-temperature four-point bend tests, optical microscopy, profilometry, and atomic force microscopy. The average strength of bonds between niobium and polished alumina substrates increased with the introduction of copper film interlayers, and the scatter in strength tended to decrease, with an optimum combination of strength and Weibull modulus arising for a copper film thickness of 3.0 {micro}m. The strength characteristics of niobium bonded to unpolished alumina substrates were also improved by liquid-film-assisted joining, but were unaffected by the thickness of the copper interlayers.

Subject

  • Keyword: Copper
  • Keyword: Thickness
  • Keyword: Diffusion
  • Keyword: Substrates
  • Keyword: Processing
  • STI Subject Categories: 36 Materials Science
  • Keyword: Roughness
  • Keyword: Atomic Force Microscopy
  • Keyword: Brazing
  • Keyword: Microstructure
  • Keyword: Optical Microscopy
  • Keyword: Fractures
  • Keyword: Mating
  • Keyword: Niobium

Source

  • Journal Name: Welding Journal; Journal Volume: 84; Journal Issue: 3; Related Information: Journal Publication Date: 03/2005

Collection

  • Name: Office of Scientific & Technical Information Technical Reports
    Code: OSTI

Institution

  • Name: UNT Libraries Government Documents Department
    Code: UNTGD

Resource Type

  • Article

Format

  • Text

Identifier

  • Report No.: LBNL--55738
  • Grant Number: DE-AC02-05CH11231
  • Office of Scientific & Technical Information Report Number: 877320
  • Archival Resource Key: ark:/67531/metadc873254