Processing of alumina-niobium interfaces via liquid-film-assistedjoining

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Alumina-niobium interfaces were fabricated at 1400 C via solid-state diffusion brazing of a 127-{micro}m-thick niobium foil between alumina blocks. Prior to brazing, some of the alumina mating surfaces, both polished and unpolished, were evaporation-coated with copper films {approx}1.4 {micro}m, {approx}3.0 {micro}m, and {approx}5.5 {micro}m thick to induce liquid-film-assisted joining at the brazing temperature. The effects of copper film thickness and surface roughness on fracture characteristics and ceramic-metal interfacial microstructure were investigated by room-temperature four-point bend tests, optical microscopy, profilometry, and atomic force microscopy. The average strength of bonds between niobium and polished alumina substrates increased with the introduction of copper ... continued below

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McKeown, Joseph T.; Sugar, Joshua D.; Gronsky, Ronald & Glaeser,Andreas M. February 15, 2005.

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Alumina-niobium interfaces were fabricated at 1400 C via solid-state diffusion brazing of a 127-{micro}m-thick niobium foil between alumina blocks. Prior to brazing, some of the alumina mating surfaces, both polished and unpolished, were evaporation-coated with copper films {approx}1.4 {micro}m, {approx}3.0 {micro}m, and {approx}5.5 {micro}m thick to induce liquid-film-assisted joining at the brazing temperature. The effects of copper film thickness and surface roughness on fracture characteristics and ceramic-metal interfacial microstructure were investigated by room-temperature four-point bend tests, optical microscopy, profilometry, and atomic force microscopy. The average strength of bonds between niobium and polished alumina substrates increased with the introduction of copper film interlayers, and the scatter in strength tended to decrease, with an optimum combination of strength and Weibull modulus arising for a copper film thickness of 3.0 {micro}m. The strength characteristics of niobium bonded to unpolished alumina substrates were also improved by liquid-film-assisted joining, but were unaffected by the thickness of the copper interlayers.

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  • Journal Name: Welding Journal; Journal Volume: 84; Journal Issue: 3; Related Information: Journal Publication Date: 03/2005

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  • Report No.: LBNL--55738
  • Grant Number: DE-AC02-05CH11231
  • Office of Scientific & Technical Information Report Number: 877320
  • Archival Resource Key: ark:/67531/metadc873254

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  • February 15, 2005

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  • Sept. 21, 2016, 2:29 a.m.

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  • Sept. 29, 2016, 3:54 p.m.

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McKeown, Joseph T.; Sugar, Joshua D.; Gronsky, Ronald & Glaeser,Andreas M. Processing of alumina-niobium interfaces via liquid-film-assistedjoining, article, February 15, 2005; Berkeley, California. (digital.library.unt.edu/ark:/67531/metadc873254/: accessed August 19, 2017), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.