Numerical Model for Conduction-Cooled Current Lead Heat Loads

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Current leads are utilized to deliver electrical power from a room temperature junction mounted on the vacuum vessel to a superconducting magnet located within the vacuum space of a cryostat. There are many types of current leads used at laboratories throughout the world; however, conduction-cooled current leads are often chosen for their simplicity and reliability. Conduction-cooled leads have the advantage of using common materials, have no superconducting/normal state transition, and have no boil-off vapor to collect. This paper presents a numerical model for conduction-cooled current lead heat loads. This model takes into account varying material and fluid thermal properties, varying ... continued below

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8 pages

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White, M. J.; Wang, X. L. & Brueck, H. D. June 10, 2011.

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Current leads are utilized to deliver electrical power from a room temperature junction mounted on the vacuum vessel to a superconducting magnet located within the vacuum space of a cryostat. There are many types of current leads used at laboratories throughout the world; however, conduction-cooled current leads are often chosen for their simplicity and reliability. Conduction-cooled leads have the advantage of using common materials, have no superconducting/normal state transition, and have no boil-off vapor to collect. This paper presents a numerical model for conduction-cooled current lead heat loads. This model takes into account varying material and fluid thermal properties, varying thicknesses along the length of the lead, heat transfer in the circumferential and longitudinal directions, electrical power dissipation, and the effect of thermal intercepts. The model is validated by comparing the numerical model results to ideal cases where analytical equations are valid. In addition, the XFEL (X-Ray Free Electron Laser) prototype current leads are modeled and compared to the experimental results from testing at DESY's XFEL Magnet Test Stand (XMTS) and Cryomodule Test Bench (CMTB).

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8 pages

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  • Presented at Cryogenic Engineering Conference and International Cryogenic Materials Conference CEC-ICMC 2011, Spokane, Washington, 13-17 June 2011

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  • Report No.: FERMILAB-CONF-11-263-AD
  • Grant Number: AC02-07CH11359
  • Office of Scientific & Technical Information Report Number: 1021485
  • Archival Resource Key: ark:/67531/metadc840162

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Office of Scientific & Technical Information Technical Reports

Reports, articles and other documents harvested from the Office of Scientific and Technical Information.

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  • June 10, 2011

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  • May 19, 2016, 3:16 p.m.

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  • Aug. 29, 2016, 8:56 p.m.

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White, M. J.; Wang, X. L. & Brueck, H. D. Numerical Model for Conduction-Cooled Current Lead Heat Loads, article, June 10, 2011; Batavia, Illinois. (digital.library.unt.edu/ark:/67531/metadc840162/: accessed September 21, 2018), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.