D0 Silicon Upgrade: Ladder Assembly Sequences

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This is an abridged version of the assembly sequence described by the DO assembly subgroup of Cooper, Hrycyk, Kowalski, Rapidis, and Ratzmann. This primarily is used to indicate major steps during the sequence and to list fixturing requirements. Assembly - (1) Place support rails in (1) 3 Chip Ladder Construction fixture. The two rails get held under vacuum. (2) Apply adhesive to the region where contact will be made with the beryllium substrates. (3) Place underside beryllium pieces (active and dummy ends) into the (1) 3 Chip Ladder Construction fixture. These pieces get placed in the fixture against the appropriate ... continued below

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3 pages

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Ratzmann, Paul August 17, 1994.

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Description

This is an abridged version of the assembly sequence described by the DO assembly subgroup of Cooper, Hrycyk, Kowalski, Rapidis, and Ratzmann. This primarily is used to indicate major steps during the sequence and to list fixturing requirements. Assembly - (1) Place support rails in (1) 3 Chip Ladder Construction fixture. The two rails get held under vacuum. (2) Apply adhesive to the region where contact will be made with the beryllium substrates. (3) Place underside beryllium pieces (active and dummy ends) into the (1) 3 Chip Ladder Construction fixture. These pieces get placed in the fixture against the appropriate pins to mimic final positioning in the bulkhead. Apply vacuum to the beryllium pieces. Allow to cure? (4) Align silicon in (1) 3 Chip Ladder Construction fixture. Reference features on the fixture will be parameterized. Holes in the fixture near the silicon center line will be targeted to set the silicon axis relative to the beryllium slot edge. Z positioning of the detectors will be achieved by shimming between the detectors and butting up the end of the silicon against the fixture. (5) Remove silicon detectors and apply adhesive to the rails and upper surfaces of the beryllium. (6) Replace silicon and check final position of the detectors. (7) Release vacuum on the rails so they cure in a stress-free state. Allow adhesive to cure. (8) Apply adhesive and align HDI to the silicon using (2) 3 Chip HDI Gluing fixture. The HDI will have tabs which are held by the fixture for location relative to the detectors. Allow adhesive to cure. (9) Move ladder to (3) 3 Chip Wirebonding Fixture. Transfer fixture to the wirebonder and bond chip-silicon and silicon-silicon.

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3 pages

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  • Report No.: FERMILAB-D0-EN-415
  • Grant Number: AC02-07CH11359
  • DOI: 10.2172/1033316 | External Link
  • Office of Scientific & Technical Information Report Number: 1033316
  • Archival Resource Key: ark:/67531/metadc839409

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Office of Scientific & Technical Information Technical Reports

Reports, articles and other documents harvested from the Office of Scientific and Technical Information.

Office of Scientific and Technical Information (OSTI) is the Department of Energy (DOE) office that collects, preserves, and disseminates DOE-sponsored research and development (R&D) results that are the outcomes of R&D projects or other funded activities at DOE labs and facilities nationwide and grantees at universities and other institutions.

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Creation Date

  • August 17, 1994

Added to The UNT Digital Library

  • May 19, 2016, 3:16 p.m.

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  • Aug. 30, 2016, 4:09 p.m.

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Ratzmann, Paul. D0 Silicon Upgrade: Ladder Assembly Sequences, report, August 17, 1994; Batavia, Illinois. (digital.library.unt.edu/ark:/67531/metadc839409/: accessed December 13, 2017), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.