HIGH-DENSITY, BIO-COMPATIBLE, AND HERMETIC ELECTRICAL FEEDTHROUGHS USING EXTRUDED METAL VIAS

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Implanted medical devices such as pacemakers and neural prosthetics require that the electronic components that power these devices are protected from the harsh chemical and biological environment of the body. Typically, the electronics are hermetically sealed inside a bio-compatible package containing feedthroughs that transmit electrical signals, while being impermeable to particles or moisture. We present a novel approach for fabricating one of the highest densities of biocompatible hermetic feedthroughs in alumina (Al{sub 2}O{sub 3}). Alumina substrates with laser machined vias of 200 {mu}m pitch were conformally metallized and lithographically patterned. Hermetic electrical feedthroughs were formed by extruding metal studbumps partially ... continued below

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6 p. (0.4 MB)

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Tooker, A; Shah, K; Tolosa, V; Sheth, H; Felix, S; Delima, T et al. March 29, 2012.

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Implanted medical devices such as pacemakers and neural prosthetics require that the electronic components that power these devices are protected from the harsh chemical and biological environment of the body. Typically, the electronics are hermetically sealed inside a bio-compatible package containing feedthroughs that transmit electrical signals, while being impermeable to particles or moisture. We present a novel approach for fabricating one of the highest densities of biocompatible hermetic feedthroughs in alumina (Al{sub 2}O{sub 3}). Alumina substrates with laser machined vias of 200 {mu}m pitch were conformally metallized and lithographically patterned. Hermetic electrical feedthroughs were formed by extruding metal studbumps partially through the vias. Hermeticity testing showed leak rates better than 9x10{sup -10} torr-l/s. Based on our preliminary results and process optimization, this extruded metal via approach is a high-density, low temperature, cost-effective, and robust method of miniaturizing electrical feedthroughs for a wide range of implantable bio-medical device applications.

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6 p. (0.4 MB)

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PDF-file: 6 pages; size: 0.4 Mbytes

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  • Presented at: Hilton Head Workshop 2012: Solid-State Sensors, Actuators, and Microsystems, Hilton Head, SC, United States, Jun 03 - Jun 07, 2012

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  • Report No.: LLNL-CONF-544073
  • Grant Number: W-7405-ENG-48
  • Office of Scientific & Technical Information Report Number: 1047249
  • Archival Resource Key: ark:/67531/metadc836939

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  • March 29, 2012

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  • May 19, 2016, 9:45 a.m.

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  • April 17, 2017, 12:20 p.m.

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Tooker, A; Shah, K; Tolosa, V; Sheth, H; Felix, S; Delima, T et al. HIGH-DENSITY, BIO-COMPATIBLE, AND HERMETIC ELECTRICAL FEEDTHROUGHS USING EXTRUDED METAL VIAS, article, March 29, 2012; Livermore, California. (digital.library.unt.edu/ark:/67531/metadc836939/: accessed December 17, 2018), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.