Use of Melt Flow Rate Test in Reliability Study of Thermoplastic Encapsulation Materials in Photovoltaic Modules

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Use of thermoplastic materials as encapsulants in photovoltaic (PV) modules presents a potential concern in terms of high temperature creep, which should be evaluated before thermoplastics are qualified for use in the field. Historically, the issue of creep has been avoided by using thermosetting polymers as encapsulants, such as crosslinked ethylene-co-vinyl acetate (EVA). Because they lack crosslinked networks, however, thermoplastics may be subject to phase transitions and visco-elastic flow at the temperatures and mechanical stresses encountered by modules in the field, creating the potential for a number of reliability and safety issues. Thermoplastic materials investigated in this study include PV-grade ... continued below

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20 p.

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Moseley, J.; Miller, D.; Shah, Q.-U.-A. S. J.; Sakurai, K.; Kempe, M.; Tamizhmani, G. et al. October 1, 2011.

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Use of thermoplastic materials as encapsulants in photovoltaic (PV) modules presents a potential concern in terms of high temperature creep, which should be evaluated before thermoplastics are qualified for use in the field. Historically, the issue of creep has been avoided by using thermosetting polymers as encapsulants, such as crosslinked ethylene-co-vinyl acetate (EVA). Because they lack crosslinked networks, however, thermoplastics may be subject to phase transitions and visco-elastic flow at the temperatures and mechanical stresses encountered by modules in the field, creating the potential for a number of reliability and safety issues. Thermoplastic materials investigated in this study include PV-grade uncured-EVA (without curing agents and therefore not crosslinked); polyvinyl butyral (PVB); thermoplastic polyurethane (TPU); and three polyolefins (PO), which have been proposed for use as PV encapsulation. Two approaches were used to evaluate the performance of these materials as encapsulants: module-level testing and a material-level testing.

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20 p.

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  • Report No.: NREL/TP-5200-52586
  • Grant Number: AC36-08GO28308
  • DOI: 10.2172/1027154 | External Link
  • Office of Scientific & Technical Information Report Number: 1027154
  • Archival Resource Key: ark:/67531/metadc835893

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  • October 1, 2011

Added to The UNT Digital Library

  • May 19, 2016, 3:16 p.m.

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  • April 4, 2017, 1:36 p.m.

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Moseley, J.; Miller, D.; Shah, Q.-U.-A. S. J.; Sakurai, K.; Kempe, M.; Tamizhmani, G. et al. Use of Melt Flow Rate Test in Reliability Study of Thermoplastic Encapsulation Materials in Photovoltaic Modules, report, October 1, 2011; Golden, Colorado. (digital.library.unt.edu/ark:/67531/metadc835893/: accessed May 21, 2018), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.