Modeling tin whisker growth.

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Description

Tin, lead, and lead-tin solders are the most commonly used solders due to their low melting temperatures. However, due to the toxicity problems, lead must now be removed from solder materials. This has lead to the re-emergence of the issue of tin whisker growth. Tin whiskers are a microelectronic packaging issue because they can lead to shorts if they grow to sufficient length. However, the cause of tin whisker growth is still not well understood and there is lack of robust methods to determine when and if whiskering will be a problem. This report summarizes some of the leading theories ... continued below

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31 p.

Creation Information

Weinberger, Christopher Robert August 1, 2013.

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This report is part of the collection entitled: Office of Scientific & Technical Information Technical Reports and was provided by UNT Libraries Government Documents Department to Digital Library, a digital repository hosted by the UNT Libraries. More information about this report can be viewed below.

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  • Sandia National Laboratories
    Publisher Info: Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)
    Place of Publication: Albuquerque, New Mexico

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Description

Tin, lead, and lead-tin solders are the most commonly used solders due to their low melting temperatures. However, due to the toxicity problems, lead must now be removed from solder materials. This has lead to the re-emergence of the issue of tin whisker growth. Tin whiskers are a microelectronic packaging issue because they can lead to shorts if they grow to sufficient length. However, the cause of tin whisker growth is still not well understood and there is lack of robust methods to determine when and if whiskering will be a problem. This report summarizes some of the leading theories on whisker growth and attempts to provide some ideas towards establishing the role microstructure plays in whisker growth.

Physical Description

31 p.

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Identifier

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  • Report No.: SAND2013-6818
  • Grant Number: AC04-94AL85000
  • Office of Scientific & Technical Information Report Number: 1096472
  • Archival Resource Key: ark:/67531/metadc828749

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Office of Scientific & Technical Information Technical Reports

Reports, articles and other documents harvested from the Office of Scientific and Technical Information.

Office of Scientific and Technical Information (OSTI) is the Department of Energy (DOE) office that collects, preserves, and disseminates DOE-sponsored research and development (R&D) results that are the outcomes of R&D projects or other funded activities at DOE labs and facilities nationwide and grantees at universities and other institutions.

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Creation Date

  • August 1, 2013

Added to The UNT Digital Library

  • May 19, 2016, 9:45 a.m.

Description Last Updated

  • June 17, 2016, 3:20 p.m.

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Weinberger, Christopher Robert. Modeling tin whisker growth., report, August 1, 2013; Albuquerque, New Mexico. (digital.library.unt.edu/ark:/67531/metadc828749/: accessed June 24, 2018), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.