Study of Metal Whiskers Growth and Mitigation Technique Using Additive Manufacturing Page: 42
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5.2 Directions of Future Research
The stress in the Sn film should be evaluated in situ as well as over time. We have stress
measurement tool that will be attached to the Aerosol Jet machine to provide real time stress
measurements during deposition. Multi-beam optical stress sensor (MOSS) technique measures
local stress. MOSS technique employs an array of parallel laser beams, and measures the relative
change in the spacing between them (Figure 30). MOSS is insensitive to vibrations, and it has been
used for thin-film stress monitoring in a variety of problems [62, 63].
(a) Si M(b_ S
(1 Sn
SSi
4-IMC
iCu
Figure 30 The schematic of MOSS setup used to measure the curvature of a system. Curvature
measurements: (a) before the deposition, of bare wafers, (b) after depositing Sn films [63]
Additionally, the film should be aged and evaluated for whiskers growth. An interesting
study will be to evaluate the stress gradient, volume gradient, and texture gradient in the Sn film
since it has not been done before and see if Aerosol Jet deposition can sustain uniformity of
these parameters over time and under operating conditions.
Finally, will be good to model the film conditions and the evolution of stress and
microstructure of the Sn film using combination of software package and custom made code
when need it.42
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Gullapalli, Vikranth. Study of Metal Whiskers Growth and Mitigation Technique Using Additive Manufacturing, thesis, August 2015; Denton, Texas. (https://digital.library.unt.edu/ark:/67531/metadc804972/m1/52/: accessed April 17, 2024), University of North Texas Libraries, UNT Digital Library, https://digital.library.unt.edu; .