Mold heating and cooling microprocessor conversion. Final report

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Description

Conversion of the microprocessors and software for the Mold Heating and Cooling (MHAC) pump package control systems was initiated to allow required system enhancements and provide data communications capabilities with the Plastics Information and Control System (PICS). The existing microprocessor-based control systems for the pump packages use an Intel 8088-based microprocessor board with a maximum of 64 Kbytes of program memory. The requirements for the system conversion were developed, and hardware has been selected to allow maximum reuse of existing hardware and software while providing the required additional capabilities and capacity. The new hardware will incorporate an Intel 80286-based microprocessor ... continued below

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19 p.

Creation Information

Hoffman, D.P. July 1, 1995.

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This report is part of the collection entitled: Office of Scientific & Technical Information Technical Reports and was provided by UNT Libraries Government Documents Department to Digital Library, a digital repository hosted by the UNT Libraries. More information about this report can be viewed below.

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  • Allied-Signal Aerospace Company
    Publisher Info: Allied-Signal Aerospace Co., Kansas City, MO (United States). Kansas City Div.
    Place of Publication: Kansas City, Missouri

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Description

Conversion of the microprocessors and software for the Mold Heating and Cooling (MHAC) pump package control systems was initiated to allow required system enhancements and provide data communications capabilities with the Plastics Information and Control System (PICS). The existing microprocessor-based control systems for the pump packages use an Intel 8088-based microprocessor board with a maximum of 64 Kbytes of program memory. The requirements for the system conversion were developed, and hardware has been selected to allow maximum reuse of existing hardware and software while providing the required additional capabilities and capacity. The new hardware will incorporate an Intel 80286-based microprocessor board with an 80287 math coprocessor, the system includes additional memory, I/O, and RS232 communication ports.

Physical Description

19 p.

Notes

OSTI as DE95015450

Source

  • Other Information: PBD: Jul 1995

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  • Other: DE95015450
  • Report No.: KCP--613-5516
  • Grant Number: AC04-76DP00613
  • DOI: 10.2172/95354 | External Link
  • Office of Scientific & Technical Information Report Number: 95354
  • Archival Resource Key: ark:/67531/metadc793423

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Office of Scientific & Technical Information Technical Reports

Reports, articles and other documents harvested from the Office of Scientific and Technical Information.

Office of Scientific and Technical Information (OSTI) is the Department of Energy (DOE) office that collects, preserves, and disseminates DOE-sponsored research and development (R&D) results that are the outcomes of R&D projects or other funded activities at DOE labs and facilities nationwide and grantees at universities and other institutions.

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Creation Date

  • July 1, 1995

Added to The UNT Digital Library

  • Dec. 19, 2015, 7:14 p.m.

Description Last Updated

  • Feb. 20, 2017, 3:07 p.m.

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Hoffman, D.P. Mold heating and cooling microprocessor conversion. Final report, report, July 1, 1995; Kansas City, Missouri. (digital.library.unt.edu/ark:/67531/metadc793423/: accessed October 18, 2018), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.