Reproducibility Data on SUMMiT

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Description

SUMMiT (Sandia Ultra-planar Multi-level MEMS Technology) at the Sandia National Laboratories' MDL (Microelectronics Development Laboratory) is a standardized MEMS (Microelectromechanical Systems) technology that allows designers to fabricate concept prototypes. This technology provides four polysilicon layers plus three sacrificial oxide layers (with the third oxide layer being planarized) to enable fabrication of complex mechanical systems-on-a-chip. Quantified reproducibility of the SUMMiT process is important for process engineers as well as designers. Summary statistics for critical MEMS technology parameters such as film thickness, line width, and sheet resistance will be reported for the SUMMiT process. Additionally, data from Van der Pauw test structures ... continued below

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11 p.

Creation Information

Irwin, Lloyd; Jakubczak, Jay; Limary, Siv; McBrayer, John; Montague, Stephen; Smith, James et al. July 16, 1999.

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This article is part of the collection entitled: Office of Scientific & Technical Information Technical Reports and was provided by UNT Libraries Government Documents Department to Digital Library, a digital repository hosted by the UNT Libraries. More information about this article can be viewed below.

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  • Sandia National Laboratories
    Publisher Info: Sandia National Labs., Albuquerque, NM (United States)
    Place of Publication: Albuquerque, New Mexico

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Description

SUMMiT (Sandia Ultra-planar Multi-level MEMS Technology) at the Sandia National Laboratories' MDL (Microelectronics Development Laboratory) is a standardized MEMS (Microelectromechanical Systems) technology that allows designers to fabricate concept prototypes. This technology provides four polysilicon layers plus three sacrificial oxide layers (with the third oxide layer being planarized) to enable fabrication of complex mechanical systems-on-a-chip. Quantified reproducibility of the SUMMiT process is important for process engineers as well as designers. Summary statistics for critical MEMS technology parameters such as film thickness, line width, and sheet resistance will be reported for the SUMMiT process. Additionally, data from Van der Pauw test structures will be presented. Data on film thickness, film uniformity and critical dimensions of etched line widths are collected from both process and monitor wafers during manufacturing using film thickness metrology tools and SEM tools. A standardized diagnostic module is included in each SWiT run to obtain post-processing parametric data to monitor run-to-run reproducibility such as Van der Pauw structures for measuring sheet resistance. This characterization of the SUMMiT process enables design for manufacturability in the SUMMiT technology.

Physical Description

11 p.

Notes

OSTI as DE00009014

Medium: P; Size: 11 pages

Source

  • Micromachining and Microfabrication Process Technology, Santa Clara, CA (US), 09/20/1999--09/23/1999

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  • Report No.: SAND99-1805C
  • Grant Number: AC04-94AL85000
  • Office of Scientific & Technical Information Report Number: 9014
  • Archival Resource Key: ark:/67531/metadc792735

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Office of Scientific & Technical Information Technical Reports

Reports, articles and other documents harvested from the Office of Scientific and Technical Information.

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Creation Date

  • July 16, 1999

Added to The UNT Digital Library

  • Dec. 19, 2015, 7:14 p.m.

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  • April 6, 2017, 7:36 p.m.

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Irwin, Lloyd; Jakubczak, Jay; Limary, Siv; McBrayer, John; Montague, Stephen; Smith, James et al. Reproducibility Data on SUMMiT, article, July 16, 1999; Albuquerque, New Mexico. (digital.library.unt.edu/ark:/67531/metadc792735/: accessed October 22, 2018), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.