Novel method for making semiconductor chips. Seventh quarterly and final report, January 7, 1995--May 7, 1995

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Work under DOE Grant No. DE-FG47-93R701314, to investigate a Novel Process for Fabricating MOSFET Devices, has progressed to a point where feasibility of producing MOSFETS using Chromium Disilicide Schottky barrier junctions at Source and Drain has been shown. Devices fabricated, however, show inconsistent operating characteristics from device to device, and further work is required to overcome the defects. Some fabrication procedures have produced a relatively high, (e.g., ninety-five (95%) percent), yield of devices on a substrate which show at least some transistor action, while others have resulted in very low yield, (e.g., five (5%) percent). Consistency of results from device … continued below

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291 p.

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Creator: Unknown. July 1, 1995.

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This report is part of the collection entitled: Office of Scientific & Technical Information Technical Reports and was provided by the UNT Libraries Government Documents Department to the UNT Digital Library, a digital repository hosted by the UNT Libraries. It has been viewed 13 times. More information about this report can be viewed below.

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Work under DOE Grant No. DE-FG47-93R701314, to investigate a Novel Process for Fabricating MOSFET Devices, has progressed to a point where feasibility of producing MOSFETS using Chromium Disilicide Schottky barrier junctions at Source and Drain has been shown. Devices fabricated, however, show inconsistent operating characteristics from device to device, and further work is required to overcome the defects. Some fabrication procedures have produced a relatively high, (e.g., ninety-five (95%) percent), yield of devices on a substrate which show at least some transistor action, while others have resulted in very low yield, (e.g., five (5%) percent). Consistency of results from device to device is less than desired. However, considering that the University of Nebraska at Lincoln (UNL) Electrical Engineering Fabrication Lab is not what industry can provide, it is reasonable to project that essentially one-hundred (99.99+%) percent yield should be achievable in an industrial setting because of the simplicity in the fabrication procedure.

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291 p.

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OSTI as DE95014927

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Office of Scientific & Technical Information Technical Reports

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  • July 1, 1995

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  • Dec. 19, 2015, 7:14 p.m.

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Novel method for making semiconductor chips. Seventh quarterly and final report, January 7, 1995--May 7, 1995, report, July 1, 1995; United States. (https://digital.library.unt.edu/ark:/67531/metadc791588/: accessed May 18, 2025), University of North Texas Libraries, UNT Digital Library, https://digital.library.unt.edu; crediting UNT Libraries Government Documents Department.

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