Carbon microstructures for electrochemical studies Page: 3 of 7
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Fabrication of Microelectrode Arrays. A schematic representation of the
processing steps used to fabricate the microelectrode arrays is illustrated in Figure 1.
Starting from the top of the figure, the steps involve:CVD of Si 3N4 layer on Si wafer
Fig. 1. Schematic representation of the
processing steps to fabricate three-
dimensional carbon microstructures.
Left - top view. Right - side view.Spin coat photoresist on Si3N4/Si wafer
Pattern current collector by photolithography0 S
a.SSpin coat second layer photoresist
.E:Pattern post structure by photolithography
Heat treat to form carbon post structureStep 1. CVD silicon nitride layer (-100 nm thick) on silicon water.
Step 2. Spin coat photoresist on silicon nitride layer.
Step 3. Pattern photoresist by photolithography to form interdigitated arrays.
Step 4. Develop and process photoresist. (not shown in Fig. 1)
Step 5. Heat treat wafer to carbonize photoresist to form interdigitated current collector
arrays.Step 6. Spin coat second layer of photoresist.
Heat treat to form carbon current collector
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Kostecki, Robert; Song, Xiang Yun & Kinoshita, Kim. Carbon microstructures for electrochemical studies, report, June 22, 2001; Berkeley, California. (https://digital.library.unt.edu/ark:/67531/metadc783183/m1/3/: accessed April 24, 2024), University of North Texas Libraries, UNT Digital Library, https://digital.library.unt.edu; crediting UNT Libraries Government Documents Department.