A flexible package and interconnects for microfluidic systems

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Description

A slide-together compression package and microfluidic interconnects for microfabricated devices requiring fluidic and electrical connections is presented. The package assembles without tools, is reusable, and requires no epoxy, wirebonds, or solder, making chip replacement fast and easy. The microfluidic interconnects use standard HPLC PEEK tubing, with the tip machined to accept either an o-ring or custom molded ring which serves the dual function of forming the seal and providing mechanical retention strength. One design uses a screw to compress the o-ring, while others are simply plugged into a cartridge retained in the package. The connectors are helium leak-tight, can withstand ... continued below

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3.6 Megabytes pages

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Benett, W & Krulevitch, P January 1, 1999.

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Description

A slide-together compression package and microfluidic interconnects for microfabricated devices requiring fluidic and electrical connections is presented. The package assembles without tools, is reusable, and requires no epoxy, wirebonds, or solder, making chip replacement fast and easy. The microfluidic interconnects use standard HPLC PEEK tubing, with the tip machined to accept either an o-ring or custom molded ring which serves the dual function of forming the seal and providing mechanical retention strength. One design uses a screw to compress the o-ring, while others are simply plugged into a cartridge retained in the package. The connectors are helium leak-tight, can withstand hundreds of psi, are easy to connect and disconnect, are low dead volume, have a small footprint, and are adaptable to a broad range of microfabricated devices.

Physical Description

3.6 Megabytes pages

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  • The International Society for Optical Engineering, International Symposium on Biomedical Optics, BIOS'99, San Jose, CA (US), 01/23/1999--01/29/1999

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  • Report No.: UCRL-JC-132967
  • Report No.: YN0100000
  • Grant Number: W-7405-ENG-48
  • Office of Scientific & Technical Information Report Number: 8582
  • Archival Resource Key: ark:/67531/metadc781818

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Office of Scientific & Technical Information Technical Reports

Reports, articles and other documents harvested from the Office of Scientific and Technical Information.

Office of Scientific and Technical Information (OSTI) is the Department of Energy (DOE) office that collects, preserves, and disseminates DOE-sponsored research and development (R&D) results that are the outcomes of R&D projects or other funded activities at DOE labs and facilities nationwide and grantees at universities and other institutions.

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  • January 1, 1999

Added to The UNT Digital Library

  • Dec. 3, 2015, 9:30 a.m.

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  • May 6, 2016, 1:23 p.m.

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Benett, W & Krulevitch, P. A flexible package and interconnects for microfluidic systems, article, January 1, 1999; California. (digital.library.unt.edu/ark:/67531/metadc781818/: accessed October 18, 2017), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.