Wafer-Bonded Internal Back-Surface Reflectors for Enhanced TPV Performance

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Description

This paper discusses recent efforts to realize GaInAsSb/GaSb TPV cells with an internal back-surface reflector (BSR). The cells are fabricated by wafer bonding the GaInAsSb/GaSb device layers to GaAs substrates with a dielectric/Au reflector, and subsequently removing the GaSb substrate. The internal BSR enhances optical absorption within the device while the dielectric layer provides electrical isolation. This approach is compatible with monolithic integration of series-connected TPV cells and can mitigate the requirements of filters used for front-surface spectral control.

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4148 Kilobytes pages

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Wang, C.A.; Murphy, P.G.; O'Brien, P.W.; Shiau, D.A.; Anderson, A.C.; Liau, Z.L. et al. August 12, 2002.

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  • Lockheed Martin
    Publisher Info: Lockheed Martin Corporation, Schenectady, NY 12301 (United States)
    Place of Publication: Schenectady, New York

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Description

This paper discusses recent efforts to realize GaInAsSb/GaSb TPV cells with an internal back-surface reflector (BSR). The cells are fabricated by wafer bonding the GaInAsSb/GaSb device layers to GaAs substrates with a dielectric/Au reflector, and subsequently removing the GaSb substrate. The internal BSR enhances optical absorption within the device while the dielectric layer provides electrical isolation. This approach is compatible with monolithic integration of series-connected TPV cells and can mitigate the requirements of filters used for front-surface spectral control.

Physical Description

4148 Kilobytes pages

Notes

OSTI as DE00821703

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  • Other Information: PBD: 12 Aug 2002

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  • Report No.: LM-02K065
  • Grant Number: AC12-00SN39357
  • DOI: 10.2172/821703 | External Link
  • Office of Scientific & Technical Information Report Number: 821703
  • Archival Resource Key: ark:/67531/metadc781395

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  • August 12, 2002

Added to The UNT Digital Library

  • Dec. 3, 2015, 9:30 a.m.

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  • April 28, 2016, 9:44 p.m.

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Wang, C.A.; Murphy, P.G.; O'Brien, P.W.; Shiau, D.A.; Anderson, A.C.; Liau, Z.L. et al. Wafer-Bonded Internal Back-Surface Reflectors for Enhanced TPV Performance, report, August 12, 2002; Schenectady, New York. (digital.library.unt.edu/ark:/67531/metadc781395/: accessed December 16, 2017), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.