Mesoscale modeling of grain boundary migration under stress using coupled finite element and meshfree methods.

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The process of grain boundary migration involves moving interfaces and topological changes of grain boundary geometry. This can not be effectively modeled by Lagrangian, Eulerian, or arbitrary Lagrangian Eulerian finite element formulation when stress effect is considered. A coupled finite element and meshfree approach is proposed for modeling of grain boundary migration under stress. In this formulation, the material grid carries material kinematic and kinetic variables, whereas the grain boundary grid carries grain boundary kinematic variables. The material domain is discretized by a reproducing kernel partition of unity with built-in strain discontinuity across the grain boundaries. The grain boundaries, on ... continued below

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8 pages

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Chen, J.-S.; Lu, H.; Moldovan, D. & Wolf, D. May 24, 2002.

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The process of grain boundary migration involves moving interfaces and topological changes of grain boundary geometry. This can not be effectively modeled by Lagrangian, Eulerian, or arbitrary Lagrangian Eulerian finite element formulation when stress effect is considered. A coupled finite element and meshfree approach is proposed for modeling of grain boundary migration under stress. In this formulation, the material grid carries material kinematic and kinetic variables, whereas the grain boundary grid carries grain boundary kinematic variables. The material domain is discretized by a reproducing kernel partition of unity with built-in strain discontinuity across the grain boundaries. The grain boundaries, on the other hand, are discretized by the standard finite elements. This approach allows an arbitrary evolution of grain boundaries without continuous remeshing.

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8 pages

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  • 15th ASCE Engineering Mechanics Conference, New York, NY (US), 06/02/2002--06/05/2002

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  • Report No.: ANL/MSD/CP-107772
  • Grant Number: W-31-109-ENG-38
  • Office of Scientific & Technical Information Report Number: 795811
  • Archival Resource Key: ark:/67531/metadc742790

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  • May 24, 2002

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  • Oct. 19, 2015, 7:39 p.m.

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  • March 25, 2016, 12:26 p.m.

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Chen, J.-S.; Lu, H.; Moldovan, D. & Wolf, D. Mesoscale modeling of grain boundary migration under stress using coupled finite element and meshfree methods., article, May 24, 2002; Illinois. (digital.library.unt.edu/ark:/67531/metadc742790/: accessed August 22, 2017), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.