Schneider, G.; Denbeaux, G.; Anderson, E.H.; Bates, B.; Pearson, A.L.; Meyer, M.A. et al.Dynamical x-ray microscopy investigation of electromigration in passivated inlaid Cu interconnect structures,
article,
April 26, 2002;
Berkeley, California.
(https://digital.library.unt.edu/ark:/67531/metadc740985/m1/16/:
accessed April 18, 2024),
University of North Texas Libraries, UNT Digital Library, https://digital.library.unt.edu;
crediting UNT Libraries Government Documents Department.