Structure and kinetics of Sn whisker growth on Pb-free solder finish

PDF Version Also Available for Download.

Description

Standard Leadframes used in surface mount technology are finished with a layer of eutectic SnPb for passivation and for enhancing solder wetting during reflow. When eutectic SnPb is replaced by Pb-free solder, especially the eutectic SnCu, a large number of Sn whiskers are found on the Pb-free finish. Some of the whiskers are long enough to become shorts between the neighboring legs of the leadframe. How to suppress their growth and how to perform accelerated test of Sn whisker growth are crucial reliability issues in the electronic packaging industry. In this paper, we report the study of spontaneous Sn whisker ... continued below

Physical Description

vp.

Creation Information

Choi, W.J.; Lee, T.Y.; Tu, K.N.; Tamura, N.; Celestre, R.S.; MacDowell, A.A. et al. July 11, 2002.

Context

This article is part of the collection entitled: Office of Scientific & Technical Information Technical Reports and was provided by UNT Libraries Government Documents Department to Digital Library, a digital repository hosted by the UNT Libraries. More information about this article can be viewed below.

Who

People and organizations associated with either the creation of this article or its content.

Publisher

Provided By

UNT Libraries Government Documents Department

Serving as both a federal and a state depository library, the UNT Libraries Government Documents Department maintains millions of items in a variety of formats. The department is a member of the FDLP Content Partnerships Program and an Affiliated Archive of the National Archives.

Contact Us

What

Descriptive information to help identify this article. Follow the links below to find similar items on the Digital Library.

Description

Standard Leadframes used in surface mount technology are finished with a layer of eutectic SnPb for passivation and for enhancing solder wetting during reflow. When eutectic SnPb is replaced by Pb-free solder, especially the eutectic SnCu, a large number of Sn whiskers are found on the Pb-free finish. Some of the whiskers are long enough to become shorts between the neighboring legs of the leadframe. How to suppress their growth and how to perform accelerated test of Sn whisker growth are crucial reliability issues in the electronic packaging industry. In this paper, we report the study of spontaneous Sn whisker growth at room temperature on eutectic SnCu and pure Sn finishes. Both compressive stress and surface oxide on Sn are necessary conditions for whisker growth. Structure and stress analyses by using the micro-diffraction in synchrotron radiation are reported. Cross-sectional electron microscopy, with samples prepared by focused ion beam, are included.

Physical Description

vp.

Notes

INIS; OSTI as DE00799652

Source

  • 52nd Electronic Component and Technology Conference, San Diego, CA (US), 05/28/2002--05/31/2002

Language

Item Type

Identifier

Unique identifying numbers for this article in the Digital Library or other systems.

  • Report No.: LBNL--51035
  • Grant Number: AC03-76SF00098
  • Office of Scientific & Technical Information Report Number: 799652
  • Archival Resource Key: ark:/67531/metadc740092

Collections

This article is part of the following collection of related materials.

Office of Scientific & Technical Information Technical Reports

What responsibilities do I have when using this article?

When

Dates and time periods associated with this article.

Creation Date

  • July 11, 2002

Added to The UNT Digital Library

  • Oct. 19, 2015, 7:39 p.m.

Description Last Updated

  • April 4, 2016, 6:29 p.m.

Usage Statistics

When was this article last used?

Yesterday: 0
Past 30 days: 1
Total Uses: 3

Interact With This Article

Here are some suggestions for what to do next.

Start Reading

PDF Version Also Available for Download.

Citations, Rights, Re-Use

Choi, W.J.; Lee, T.Y.; Tu, K.N.; Tamura, N.; Celestre, R.S.; MacDowell, A.A. et al. Structure and kinetics of Sn whisker growth on Pb-free solder finish, article, July 11, 2002; Berkeley, California. (digital.library.unt.edu/ark:/67531/metadc740092/: accessed September 25, 2017), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.