Study of indium and solder bumps for the BTeV Pixel Detector

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The pixel detector proposed for the BTeV experiment at the Fermilab Tevatron will use bump-bonding technology based on either Indium or Pb/Sn solder to connect the front-end readout chips to the silicon pixel sensors. We have studied the strength of the bumps by visual inspection of the bumps bonding silicon sensor modules to dummy chips made out of glass. The studies were done before and after thermal cycles, exposed to intense irradiation, and with the assemblies glued to a graphite substrate. We have also carried out studies on effects of temperature changes on both types of bump bonds by observing ... continued below

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388 Kilobytes pages

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al., Simon W Kwan et November 5, 2003.

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The pixel detector proposed for the BTeV experiment at the Fermilab Tevatron will use bump-bonding technology based on either Indium or Pb/Sn solder to connect the front-end readout chips to the silicon pixel sensors. We have studied the strength of the bumps by visual inspection of the bumps bonding silicon sensor modules to dummy chips made out of glass. The studies were done before and after thermal cycles, exposed to intense irradiation, and with the assemblies glued to a graphite substrate. We have also carried out studies on effects of temperature changes on both types of bump bonds by observing the responses of single-chip pixel detectors to an Sr{sup 90} source. We report the results from these studies and our plan to measure the effect of cryogenic temperatures on the bumps.

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388 Kilobytes pages

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  • IEEE 2003 Nuclear Science Symposium, Portland, OR (US), 10/19/2003--10/25/2003

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  • Report No.: FERMILAB-Conf-03/363-E
  • Grant Number: AC02-76CH03000
  • Office of Scientific & Technical Information Report Number: 816988
  • Archival Resource Key: ark:/67531/metadc739860

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Office of Scientific & Technical Information Technical Reports

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  • November 5, 2003

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  • Oct. 18, 2015, 6:40 p.m.

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  • April 1, 2016, 5 p.m.

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al., Simon W Kwan et. Study of indium and solder bumps for the BTeV Pixel Detector, article, November 5, 2003; Batavia, Illinois. (digital.library.unt.edu/ark:/67531/metadc739860/: accessed September 25, 2018), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.