Autonomic Healing of Epoxy Using Micro-Encapsulated Dicyclopentadiene Page: 3 of 12
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SAND2003-1590
Unlimited Release
Printed May 2003
Autonomic Healing of Epoxy Using
Micro-Encapsulated Dicyclopentadiene
Steven G. Thoma, Rachel K. Giunta, Mark E. Stavig, and John A. Emerson
Organic Materials Department
Sandia National Laboratories
P.O. Box 5800
Albuquerque, NM 87185-0958
Alfredo M. Morales
Microsystems Processing Department
Sandia National Laboratories
P.O. Box 969
Livermore, CA 94551-9401
Abstract
The autonomic healing ability of an epoxy adhesive containing micro-encapsulated
dicyclopentadiene (DCPD) was evaluated. The epoxy resin used was Epon 828 cured with either
Versamid 140 or diethylenetriamine (DETA). Variables included total weight percent of micro-
capsules (MCs) and catalyst, as well as the catalyst to DCPD ratio. The degree of healing was
determined by the fracture toughness before and after 'healing' using double-cantilever beam
analysis. It was found that the degree of self-healing was most directly related to the contact area
(i.e. crack width) during healing. Temperature also played a significant role. Observed differences
between the results of this study and those in literature are discussed.
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THOMA, STEVEN G.; GIUNTA, RACHEL K.; STAVIG, MARK E.; EMERSON, JOHN A. & MORALES, ALFREDO M. Autonomic Healing of Epoxy Using Micro-Encapsulated Dicyclopentadiene, report, May 1, 2003; Albuquerque, New Mexico. (https://digital.library.unt.edu/ark:/67531/metadc734916/m1/3/: accessed April 23, 2024), University of North Texas Libraries, UNT Digital Library, https://digital.library.unt.edu; crediting UNT Libraries Government Documents Department.