Microstructural evolution of eutectic Au-Sn solder joints Metadata

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Title

  • Main Title Microstructural evolution of eutectic Au-Sn solder joints

Creator

  • Author: Song, Ho Geon
    Creator Type: Personal

Contributor

  • Sponsor: USDOE Director, Office of Science. Office of Basic Energy Studies. Materials Science and Engineering Division (United States)
    Contributor Type: Organization

Publisher

  • Name: Lawrence Berkeley National Laboratory
    Place of Publication: Berkeley, California
    Additional Info: Ernest Orlando Lawrence Berkeley National Laboratory, Berkeley, CA (United States)

Date

  • Creation: 2002-05-31

Language

  • English

Description

  • Content Description: Current trends toward miniaturization and the use of lead(Pb)-free solder in electronic packaging present new problems in the reliability of solder joints. This study was performed in order to understand the microstructure and microstructural evolution of small volumes of nominally eutectic Au-Sn solder joints (80Au-20Sn by weight), which gives insight into properties and reliability.
  • Physical Description: vp.

Subject

  • Keyword: Eutectics
  • STI Subject Categories: 36 Materials Science
  • Keyword: Miniaturization
  • Keyword: Packaging
  • Keyword: Reliability
  • Keyword: Microstructure

Source

  • Other Information: TH: Thesis (Ph.D.); Submitted to the University of California, Berkeley, CA (US)

Collection

  • Name: Office of Scientific & Technical Information Technical Reports
    Code: OSTI

Institution

  • Name: UNT Libraries Government Documents Department
    Code: UNTGD

Resource Type

  • Thesis or Dissertation

Format

  • Text

Identifier

  • Report No.: LBNL--50573
  • Grant Number: AC03-76SF00098
  • Office of Scientific & Technical Information Report Number: 797857
  • Archival Resource Key: ark:/67531/metadc733427

Note

  • Display Note: OSTI as DE00797857