Microstructural Coarsening during Thermomechanical Fatigue and Annealing of Micro Flip-Chip Solder Joints

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Microstructural evolution due to thermal effects was studied in micro solder joints (55 {+-} 5 {micro}m). The composition of the Sn/Pb solder studied was found to be hypereutectic with a tin content of 65--70 wt%.This was determined by Energy Dispersive X-ray analysis and confirmed with quantitative stereology. The quantitative stereological value of the surface-to-volume ratio was used to characterize and compare the coarsening during thermal cycling from 0--160 C to the coarsening during annealing at 160 C. The initial coarsening of the annealed samples was more rapid than the cycled samples, but tapered off as time to the one-half as ... continued below

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Medium: P; Size: 101 pages

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Barney, Monica M. December 1, 1998.

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Description

Microstructural evolution due to thermal effects was studied in micro solder joints (55 {+-} 5 {micro}m). The composition of the Sn/Pb solder studied was found to be hypereutectic with a tin content of 65--70 wt%.This was determined by Energy Dispersive X-ray analysis and confirmed with quantitative stereology. The quantitative stereological value of the surface-to-volume ratio was used to characterize and compare the coarsening during thermal cycling from 0--160 C to the coarsening during annealing at 160 C. The initial coarsening of the annealed samples was more rapid than the cycled samples, but tapered off as time to the one-half as expected. Because the substrates to which the solder was bonded have different thermal expansion coefficients, the cycled samples experienced a mechanical strain with thermal cycling. The low-strain cycled samples had a 2.8% strain imposed on the solder and failed by 1,000 cycles, despite undergoing less coarsening than the annealed samples. The high-strain cycled samples experienced a 28% strain and failed between 25 and 250 cycles. No failures were observed in the annealed samples. Failure mechanisms and processing issues unique to small, fine pitch joints are also discussed.

Physical Description

Medium: P; Size: 101 pages

Notes

OSTI as DE00760289

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  • Other Information: TH: Thesis (M.S.); Submitted to the University of California, Berkeley; Department of Materials Science and Mineral Engineering

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  • Report No.: LBNL--42633
  • Grant Number: AC03-76SF00098
  • Office of Scientific & Technical Information Report Number: 760289
  • Archival Resource Key: ark:/67531/metadc722584

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  • December 1, 1998

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  • Sept. 29, 2015, 5:31 a.m.

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  • April 4, 2016, 3:27 p.m.

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Barney, Monica M. Microstructural Coarsening during Thermomechanical Fatigue and Annealing of Micro Flip-Chip Solder Joints, thesis or dissertation, December 1, 1998; Berkeley, California. (digital.library.unt.edu/ark:/67531/metadc722584/: accessed August 20, 2017), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.