Kovar Micro Heat Pipe Substrates for Microelectronic Cooling

PDF Version Also Available for Download.

Description

We describe the development of a new technology for cooling microelectronics. This report documents the design, fabrication, and prototype testing of micro scale heat pipes embedded in a flat plate substrate or heat spreader. A thermal model tuned to the test results enables us to describe heat transfer in the prototype, as well as evaluate the use of this technology in other applications. The substrate walls are Kovar alloy, which has a coefficient of thermal expansion close to that of microelectronic die. The prototype designs integrating micro heat pipes with Kovar enhance thermal conductivity by more than a factor of ... continued below

Physical Description

Medium: P; Size: 54 pages

Creation Information

Benson, David A.; Burchett, Steven N.; Kravitz, Stanley H.; Robino, Charles V.; Schmidt, Carrie & Tigges, Chris P. April 1999.

Context

This report is part of the collection entitled: Office of Scientific & Technical Information Technical Reports and was provided by UNT Libraries Government Documents Department to Digital Library, a digital repository hosted by the UNT Libraries. It has been viewed 12 times . More information about this report can be viewed below.

Who

People and organizations associated with either the creation of this report or its content.

Sponsor

Publishers

  • Sandia National Laboratories
    Publisher Info: Sandia National Labs., Albuquerque, NM (United States)
    Place of Publication: Albuquerque, New Mexico
  • Sandia National Laboratories
    Publisher Info: Sandia National Labs., Livermore, CA (United States)
    Place of Publication: Livermore, California

Provided By

UNT Libraries Government Documents Department

Serving as both a federal and a state depository library, the UNT Libraries Government Documents Department maintains millions of items in a variety of formats. The department is a member of the FDLP Content Partnerships Program and an Affiliated Archive of the National Archives.

Contact Us

What

Descriptive information to help identify this report. Follow the links below to find similar items on the Digital Library.

Description

We describe the development of a new technology for cooling microelectronics. This report documents the design, fabrication, and prototype testing of micro scale heat pipes embedded in a flat plate substrate or heat spreader. A thermal model tuned to the test results enables us to describe heat transfer in the prototype, as well as evaluate the use of this technology in other applications. The substrate walls are Kovar alloy, which has a coefficient of thermal expansion close to that of microelectronic die. The prototype designs integrating micro heat pipes with Kovar enhance thermal conductivity by more than a factor of two over that of Kovar alone, thus improving the cooling of micro-electronic die.

Physical Description

Medium: P; Size: 54 pages

Notes

OSTI as DE00007792

Source

  • Other Information: PBD: 1 Apr 1999

Language

Item Type

Identifier

Unique identifying numbers for this report in the Digital Library or other systems.

  • Report No.: SAND99-0714
  • Grant Number: AC04-94AL85000
  • DOI: 10.2172/7792 | External Link
  • Office of Scientific & Technical Information Report Number: 7792
  • Archival Resource Key: ark:/67531/metadc720252

Collections

This report is part of the following collection of related materials.

Office of Scientific & Technical Information Technical Reports

Reports, articles and other documents harvested from the Office of Scientific and Technical Information.

Office of Scientific and Technical Information (OSTI) is the Department of Energy (DOE) office that collects, preserves, and disseminates DOE-sponsored research and development (R&D) results that are the outcomes of R&D projects or other funded activities at DOE labs and facilities nationwide and grantees at universities and other institutions.

What responsibilities do I have when using this report?

When

Dates and time periods associated with this report.

Creation Date

  • April 1999

Added to The UNT Digital Library

  • Sept. 29, 2015, 5:31 a.m.

Description Last Updated

  • March 22, 2016, 2:39 p.m.

Usage Statistics

When was this report last used?

Yesterday: 0
Past 30 days: 2
Total Uses: 12

Interact With This Report

Here are some suggestions for what to do next.

Start Reading

PDF Version Also Available for Download.

Citations, Rights, Re-Use

Benson, David A.; Burchett, Steven N.; Kravitz, Stanley H.; Robino, Charles V.; Schmidt, Carrie & Tigges, Chris P. Kovar Micro Heat Pipe Substrates for Microelectronic Cooling, report, April 1999; Albuquerque, New Mexico. (digital.library.unt.edu/ark:/67531/metadc720252/: accessed December 10, 2017), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.