A study of thermal cycling and radiation effects on indium and solder bump bonding

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The BTeV hybrid pixel detector is constructed of readout chips and sensor arrays which are developed separately. The detector is assembled by flip-chip mating of the two parts. This method requires the availability of highly reliable, reasonably low cost fine-pitch flip-chip attachment technology. We have tested the quality of two bump-bonding technologies; indium bumps (by Advanced Interconnect Technology Ltd. (AIT) of Hong Kong) and fluxless solder bumps (by MCNC in North Carolina, USA). The results have been presented elsewhere[1]. In this paper we describe tests we performed to further evaluate these technologies. We subjected 15 indium bump-bonded and 15 fluxless ... continued below

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24 Kilobytes pages

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al., Selcuk Cihangir et September 12, 2001.

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The BTeV hybrid pixel detector is constructed of readout chips and sensor arrays which are developed separately. The detector is assembled by flip-chip mating of the two parts. This method requires the availability of highly reliable, reasonably low cost fine-pitch flip-chip attachment technology. We have tested the quality of two bump-bonding technologies; indium bumps (by Advanced Interconnect Technology Ltd. (AIT) of Hong Kong) and fluxless solder bumps (by MCNC in North Carolina, USA). The results have been presented elsewhere[1]. In this paper we describe tests we performed to further evaluate these technologies. We subjected 15 indium bump-bonded and 15 fluxless solder bump-bonded dummy detectors through a thermal cycle and then a dose of radiation to observe the effects of cooling, heating and radiation on bump-bonds.

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24 Kilobytes pages

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  • 7th Workshop on Electronics for LHC Experiments, Stockholm (SE), 09/10/2001--09/14/2001

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  • Report No.: FERMILAB-Conf-01/251-E
  • Grant Number: AC02-76CH03000
  • Office of Scientific & Technical Information Report Number: 786190
  • Archival Resource Key: ark:/67531/metadc717157

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Office of Scientific & Technical Information Technical Reports

Reports, articles and other documents harvested from the Office of Scientific and Technical Information.

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  • September 12, 2001

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  • Sept. 29, 2015, 5:31 a.m.

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  • April 1, 2016, 5:01 p.m.

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al., Selcuk Cihangir et. A study of thermal cycling and radiation effects on indium and solder bump bonding, article, September 12, 2001; Batavia, Illinois. (digital.library.unt.edu/ark:/67531/metadc717157/: accessed November 24, 2017), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.