Chemical mechanical polishing: An enabling fabrication process for surface micromachining technologies

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Chemical-Mechanical-Polishing (CMP), first used as a planarization technology in the manufacture of multi-level metal interconnects for high-density Integrated Circuits (IC), is readily adapted as an enabling technology in MicroElectroMechanical Systems (MEMS) fabrication, particularly polysilicon surface micromachining. The authors have demonstrated that CMP enhances the design and manufacturability of MEMS devices by eliminating several photolithographic definition and film etch issues generated by severe topography. In addition, CMP planarization readily allows multi-level polysilicon structures comprised of 4- or more levels of polysilicon, eliminates design compromise generated by non-planar topography, and provides an avenue for integrating different process technologies. A recent investigation has ... continued below

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11 p.

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Sniegowski, J.J. August 1, 1998.

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This article is part of the collection entitled: Office of Scientific & Technical Information Technical Reports and was provided by UNT Libraries Government Documents Department to Digital Library, a digital repository hosted by the UNT Libraries. More information about this article can be viewed below.

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  • Sandia National Laboratories
    Publisher Info: Sandia National Labs., Albuquerque, NM (United States)
    Place of Publication: Albuquerque, New Mexico

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Description

Chemical-Mechanical-Polishing (CMP), first used as a planarization technology in the manufacture of multi-level metal interconnects for high-density Integrated Circuits (IC), is readily adapted as an enabling technology in MicroElectroMechanical Systems (MEMS) fabrication, particularly polysilicon surface micromachining. The authors have demonstrated that CMP enhances the design and manufacturability of MEMS devices by eliminating several photolithographic definition and film etch issues generated by severe topography. In addition, CMP planarization readily allows multi-level polysilicon structures comprised of 4- or more levels of polysilicon, eliminates design compromise generated by non-planar topography, and provides an avenue for integrating different process technologies. A recent investigation has also shown that CMP is a valuable tool for assuring acceptable optical flatness of micro-optical components such as micromirrors. Examples of these enhancements include: an extension of polysilicon surface-micromachining fabrication to a 5-level technology, a method of monolithic integration of electronics and MEMS, and optically flat micromirrors.

Physical Description

11 p.

Notes

OSTI as DE98007196

Source

  • 194. meeting of the Electrochemical Society, Boston, MA (United States), 1-6 Nov 1998

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  • Other: DE98007196
  • Report No.: SAND--98-1326C
  • Report No.: CONF-981108--
  • Grant Number: AC04-94AL85000
  • Office of Scientific & Technical Information Report Number: 674602
  • Archival Resource Key: ark:/67531/metadc711978

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  • August 1, 1998

Added to The UNT Digital Library

  • Sept. 12, 2015, 6:31 a.m.

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  • April 14, 2016, 7:28 p.m.

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Sniegowski, J.J. Chemical mechanical polishing: An enabling fabrication process for surface micromachining technologies, article, August 1, 1998; Albuquerque, New Mexico. (digital.library.unt.edu/ark:/67531/metadc711978/: accessed August 16, 2017), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.