Impurity effects on the adhesion of aluminum films on sapphire substrates

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The adhesion of aluminum (Al) films onto sapphire substrates in the presence of controlled contaminants is being investigated. In this study, adhesion strength is evaluated by continuous scratch and nanoindentation tests to induce delamination of the Al film from the sapphire substrate. If delamination blisters or spallations can be induced, then fracture mechanics based models can be used to calculate the fracture energy or work of adhesion based on the radius of the blister. Initial specimens of 178 nm thick Al films were vapor deposited onto (0001) oriented sapphire substrates with a 5--19 nm layer of carbon sputter deposited onto ... continued below

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[30] p.

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Schneider, J.A.; Guthrie, S.E.; Clift, W.M.; Moody, N.R. & Kriese, M.D. May 1, 1998.

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  • Sandia National Laboratories
    Publisher Info: Sandia National Labs., Livermore, CA (United States)
    Place of Publication: Livermore, California

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Description

The adhesion of aluminum (Al) films onto sapphire substrates in the presence of controlled contaminants is being investigated. In this study, adhesion strength is evaluated by continuous scratch and nanoindentation tests to induce delamination of the Al film from the sapphire substrate. If delamination blisters or spallations can be induced, then fracture mechanics based models can be used to calculate the fracture energy or work of adhesion based on the radius of the blister. Initial specimens of 178 nm thick Al films were vapor deposited onto (0001) oriented sapphire substrates with a 5--19 nm layer of carbon sputter deposited onto the sapphire surface of selected samples. Continuous scratch tests promoted blistering of the film in specimens with carbon on the sapphire surface. Delamination blisters could not be induced by continuous indentation testing in samples with or without carbon at the interface. An overlayer of sputtered tantalum (Ta) was then used on a second set of 500 nm thick Al films with and without 10--20 nm of sputtered carbon on the sapphire surface to promote delaminations. With Ta overlayers, continuous nanoindentation techniques induced larger diameter delamination blisters in the specimens with carbon, than in the specimens without carbon. Resistance to blistering, or smaller induced blisters, indicates a higher interfacial strength.

Physical Description

[30] p.

Notes

OSTI as DE98052855

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  • Annual meeting of the Minerals, Metals and Materials Society (TMS), San Antonio, TX (United States), 15-19 Feb 1998

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  • Other: DE98052855
  • Report No.: SAND--98-8540C
  • Report No.: CONF-980202--
  • Grant Number: AC04-94AL85000
  • DOI: 10.2172/676886 | External Link
  • Office of Scientific & Technical Information Report Number: 676886
  • Archival Resource Key: ark:/67531/metadc710701

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  • May 1, 1998

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  • Sept. 12, 2015, 6:31 a.m.

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  • April 12, 2016, 8:17 p.m.

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Schneider, J.A.; Guthrie, S.E.; Clift, W.M.; Moody, N.R. & Kriese, M.D. Impurity effects on the adhesion of aluminum films on sapphire substrates, report, May 1, 1998; Livermore, California. (digital.library.unt.edu/ark:/67531/metadc710701/: accessed September 25, 2018), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.