Thin film circuit fabrication on diamond substrates for high power applications

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Description

Sandia Laboratories has developed a thin film diamond substrate technology to meet the requirements for high power and high density circuits. Processes were developed to metallize, photopattern, laser process, and, package diamond thin film networks which were later assembled into high power multichip modules (MCMS) to test for effectiveness at removing heat. Diamond clearly demonstrated improvement in heat transfer during 20 Watt, strip heating experiments with junction-to-ambient temperature increases of less than 24 C compared to 126 C and 265 C for the aluminum nitride and ceramic versions, respectively.

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5 p.

Creation Information

Norwood, D.; Worobey, W.; Peterson, D.; Sweet, J.; Johnson, D.; Miller, D. et al. May 1, 1995.

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This article is part of the collection entitled: Office of Scientific & Technical Information Technical Reports and was provided by UNT Libraries Government Documents Department to Digital Library, a digital repository hosted by the UNT Libraries. More information about this article can be viewed below.

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  • Sandia National Laboratories
    Publisher Info: Sandia National Labs., Albuquerque, NM (United States)
    Place of Publication: Albuquerque, New Mexico

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Description

Sandia Laboratories has developed a thin film diamond substrate technology to meet the requirements for high power and high density circuits. Processes were developed to metallize, photopattern, laser process, and, package diamond thin film networks which were later assembled into high power multichip modules (MCMS) to test for effectiveness at removing heat. Diamond clearly demonstrated improvement in heat transfer during 20 Watt, strip heating experiments with junction-to-ambient temperature increases of less than 24 C compared to 126 C and 265 C for the aluminum nitride and ceramic versions, respectively.

Physical Description

5 p.

Notes

OSTI as DE95011887

Source

  • International conference on applications of diamond films and related materials, Gaithersburg, MD (United States), 21-24 Aug 1995

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  • Other: DE95011887
  • Report No.: SAND--95-0998C
  • Report No.: CONF-950840--1
  • Grant Number: AC04-94AL85000
  • Office of Scientific & Technical Information Report Number: 71379
  • Archival Resource Key: ark:/67531/metadc710626

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Creation Date

  • May 1, 1995

Added to The UNT Digital Library

  • Sept. 12, 2015, 6:31 a.m.

Description Last Updated

  • April 14, 2016, 1:34 p.m.

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Norwood, D.; Worobey, W.; Peterson, D.; Sweet, J.; Johnson, D.; Miller, D. et al. Thin film circuit fabrication on diamond substrates for high power applications, article, May 1, 1995; Albuquerque, New Mexico. (digital.library.unt.edu/ark:/67531/metadc710626/: accessed September 20, 2017), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.