THE INFLUENCE OF NANOENGINEERED Cu DEFECTS ON ALUMINUM PITTING INITIATION

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Nanoengineering technologies have been used to generate well defined arrays of pure Cu islands within an Al thin film matrix in order to examine the impact of noble particle defects on the initiation of metastable pitting. The Cu particles form local galvanic cells with the surrounding Al matrix and drive metastable corrosion. Electrical isolation of the Cu particles from the Al occurs due to selective Al dissolution and appears to correlate to cessation of metastable events. Distributions of parameters related to the electrochemical signature of an event suggests that size and spacing of particles do not impact the signatures of ... continued below

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12 pages

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WALL,F.D.; SON,K.A.; MISSERT,N.A.; BARBOUR,J.C.; MARTINEZ,M.A.; ZAVIDIL,K.R. et al. November 1, 1999.

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Nanoengineering technologies have been used to generate well defined arrays of pure Cu islands within an Al thin film matrix in order to examine the impact of noble particle defects on the initiation of metastable pitting. The Cu particles form local galvanic cells with the surrounding Al matrix and drive metastable corrosion. Electrical isolation of the Cu particles from the Al occurs due to selective Al dissolution and appears to correlate to cessation of metastable events. Distributions of parameters related to the electrochemical signature of an event suggests that size and spacing of particles do not impact the signatures of individual events. However, event frequency data indicate that the propensity for a structure to induce localized events is linked to Cu island diameter and separation.

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12 pages

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OSTI as DE00759020

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  • PROCEEDINGS CRITICAL FACTORS IN LOCALIZED CORROSION III-A SYMPOSIUM IN HONOR OF THE 70TH BIRTHDAY OF JEROME KRUGER, BOSTON, MA (US), 11/01/1998--11/05/1998

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  • Report No.: BNL--66784
  • Report No.: KC020102
  • Grant Number: AC02-98CH10886
  • Office of Scientific & Technical Information Report Number: 759020
  • Archival Resource Key: ark:/67531/metadc710357

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  • November 1, 1999

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  • Sept. 12, 2015, 6:31 a.m.

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  • Nov. 9, 2015, 9:49 p.m.

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WALL,F.D.; SON,K.A.; MISSERT,N.A.; BARBOUR,J.C.; MARTINEZ,M.A.; ZAVIDIL,K.R. et al. THE INFLUENCE OF NANOENGINEERED Cu DEFECTS ON ALUMINUM PITTING INITIATION, article, November 1, 1999; Upton, New York. (digital.library.unt.edu/ark:/67531/metadc710357/: accessed October 17, 2017), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.