A note on the transition from coupled plasticity and damage to decohesion in the evolution of solder failure

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Description

A key issue of solder joint reliability is joint failure due to thermomechanical fatigue (TMF). TMF is caused by different coefficients of thermal expansion (CTEs) of the materials in an electronic package, combined with changes in the ambient temperature. Different CTEs result in cyclical strain in the assembly, and this strain is concentrated almost entirely in the solder because it is the most deformable portion of the package. Since solder alloy is at a significant fraction of its melting point even at room temperature, the cyclical strain enhances mass diffusion and causes dramatic changes in the alloy microstructure over time. ... continued below

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10 p.

Creation Information

CHEN,ZHEN & FANG,HUEI ELIOT April 25, 2000.

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This article is part of the collection entitled: Office of Scientific & Technical Information Technical Reports and was provided by UNT Libraries Government Documents Department to Digital Library, a digital repository hosted by the UNT Libraries. More information about this article can be viewed below.

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  • Sandia National Laboratories
    Publisher Info: Sandia National Labs., Albuquerque, NM (United States)
    Place of Publication: Albuquerque, New Mexico

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Description

A key issue of solder joint reliability is joint failure due to thermomechanical fatigue (TMF). TMF is caused by different coefficients of thermal expansion (CTEs) of the materials in an electronic package, combined with changes in the ambient temperature. Different CTEs result in cyclical strain in the assembly, and this strain is concentrated almost entirely in the solder because it is the most deformable portion of the package. Since solder alloy is at a significant fraction of its melting point even at room temperature, the cyclical strain enhances mass diffusion and causes dramatic changes in the alloy microstructure over time. As the microstructure changes and becomes coarser, the solder alloy weakens and eventually microcracks nucleate and grow in the joint, leading to component failure. the failure of solder joints is difficult to detect due to the inert nature of the electrical system. If the system is not on for extended periods then failures can not be observed. Therefore it is important to develop an advanced predictive capability which allows scientists and engineers to predict solder degradation and identify reliability problems in aging electronics early.

Physical Description

10 p.

Notes

OSTI as DE00754333

Medium: P; Size: 10 pages

Source

  • Journal Name: Journal of Applied Mechanics; Other Information: Submitted to Journal of Applied Mechanics

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  • Report No.: SAND2000-1055J
  • Report No.: 0000035229-000
  • Grant Number: AC04-94AL85000
  • Office of Scientific & Technical Information Report Number: 754333
  • Archival Resource Key: ark:/67531/metadc709884

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Office of Scientific & Technical Information Technical Reports

Reports, articles and other documents harvested from the Office of Scientific and Technical Information.

Office of Scientific and Technical Information (OSTI) is the Department of Energy (DOE) office that collects, preserves, and disseminates DOE-sponsored research and development (R&D) results that are the outcomes of R&D projects or other funded activities at DOE labs and facilities nationwide and grantees at universities and other institutions.

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Creation Date

  • April 25, 2000

Added to The UNT Digital Library

  • Sept. 12, 2015, 6:31 a.m.

Description Last Updated

  • April 6, 2017, 6:48 p.m.

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CHEN,ZHEN & FANG,HUEI ELIOT. A note on the transition from coupled plasticity and damage to decohesion in the evolution of solder failure, article, April 25, 2000; Albuquerque, New Mexico. (digital.library.unt.edu/ark:/67531/metadc709884/: accessed September 21, 2018), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.