One-sided infrared thermal imaging for flaw characterization of ceramic matrix composites

PDF Version Also Available for Download.

Description

One-sided infrared thermal imaging is being used to characterize voids and delamination in SiC/SiC composites. Flaw depth is estimated by examining the decay of surface temperature after application of a thermal pulse. Digital analysis of the surface temperature/time relationship allows characterization of the sizes and positions of defects. Results show that defects of various sizes and depths can be characterized in SiC/SiC composites with the technique.

Physical Description

9 p.

Creation Information

Deemer, C.; Sun, J. G. & Ellingson, W. A. May 16, 2000.

Context

This article is part of the collection entitled: Office of Scientific & Technical Information Technical Reports and was provided by UNT Libraries Government Documents Department to Digital Library, a digital repository hosted by the UNT Libraries. More information about this article can be viewed below.

Who

People and organizations associated with either the creation of this article or its content.

Sponsor

Publisher

Provided By

UNT Libraries Government Documents Department

Serving as both a federal and a state depository library, the UNT Libraries Government Documents Department maintains millions of items in a variety of formats. The department is a member of the FDLP Content Partnerships Program and an Affiliated Archive of the National Archives.

Contact Us

What

Descriptive information to help identify this article. Follow the links below to find similar items on the Digital Library.

Description

One-sided infrared thermal imaging is being used to characterize voids and delamination in SiC/SiC composites. Flaw depth is estimated by examining the decay of surface temperature after application of a thermal pulse. Digital analysis of the surface temperature/time relationship allows characterization of the sizes and positions of defects. Results show that defects of various sizes and depths can be characterized in SiC/SiC composites with the technique.

Physical Description

9 p.

Notes

OSTI as DE00755880

Medium: P; Size: 9 pages

Source

  • 102nd Annual Meeting of the American Ceramic Society, St. Louis, MO (US), 04/30/2000--05/03/2000

Language

Item Type

Identifier

Unique identifying numbers for this article in the Digital Library or other systems.

  • Report No.: ANL/ET/CP-101896
  • Grant Number: W-31109-ENG-38
  • Office of Scientific & Technical Information Report Number: 755880
  • Archival Resource Key: ark:/67531/metadc709731

Collections

This article is part of the following collection of related materials.

Office of Scientific & Technical Information Technical Reports

Reports, articles and other documents harvested from the Office of Scientific and Technical Information.

Office of Scientific and Technical Information (OSTI) is the Department of Energy (DOE) office that collects, preserves, and disseminates DOE-sponsored research and development (R&D) results that are the outcomes of R&D projects or other funded activities at DOE labs and facilities nationwide and grantees at universities and other institutions.

What responsibilities do I have when using this article?

When

Dates and time periods associated with this article.

Creation Date

  • May 16, 2000

Added to The UNT Digital Library

  • Sept. 12, 2015, 6:31 a.m.

Description Last Updated

  • April 11, 2017, 8:28 p.m.

Usage Statistics

When was this article last used?

Yesterday: 0
Past 30 days: 0
Total Uses: 4

Interact With This Article

Here are some suggestions for what to do next.

Start Reading

PDF Version Also Available for Download.

Citations, Rights, Re-Use

Deemer, C.; Sun, J. G. & Ellingson, W. A. One-sided infrared thermal imaging for flaw characterization of ceramic matrix composites, article, May 16, 2000; Illinois. (digital.library.unt.edu/ark:/67531/metadc709731/: accessed April 24, 2018), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.