Chemical mechanical polishing: An enabling fabrication process for surface micromachining technologies

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Description

Chemical-mechanical polishing (CMP), once it is set-up and developed in a fabrication line can be readily adapted as a planarization technique for use in polysilicon surface micromachining technology. Although the planarization is a conceptually simple step, the benefit of its inclusion in the overall fabrication process is immense. Manufacturing impediments are removed while novel, expanded processes and designs become possible. The authors anticipate that CMP planarization, in the near future, will become a standard within the MEMS community for polysilicon surface micromachining. In addition, other MEMS fabrication technologies such as bulk micromachining and LIGA can potentially benefit from CMP.

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2 p.

Creation Information

Sniegowski, J.J. August 1, 1998.

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This article is part of the collection entitled: Office of Scientific & Technical Information Technical Reports and was provided by UNT Libraries Government Documents Department to Digital Library, a digital repository hosted by the UNT Libraries. More information about this article can be viewed below.

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  • Sandia National Laboratories
    Publisher Info: Sandia National Labs., Albuquerque, NM (United States)
    Place of Publication: Albuquerque, New Mexico

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Description

Chemical-mechanical polishing (CMP), once it is set-up and developed in a fabrication line can be readily adapted as a planarization technique for use in polysilicon surface micromachining technology. Although the planarization is a conceptually simple step, the benefit of its inclusion in the overall fabrication process is immense. Manufacturing impediments are removed while novel, expanded processes and designs become possible. The authors anticipate that CMP planarization, in the near future, will become a standard within the MEMS community for polysilicon surface micromachining. In addition, other MEMS fabrication technologies such as bulk micromachining and LIGA can potentially benefit from CMP.

Physical Description

2 p.

Notes

OSTI as DE98007195

Source

  • 194. meeting of the Electrochemical Society, Boston, MA (United States), 1-6 Nov 1998

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  • Other: DE98007195
  • Report No.: SAND--98-1325C
  • Report No.: CONF-981108--
  • Grant Number: AC04-94AL85000
  • Office of Scientific & Technical Information Report Number: 674601
  • Archival Resource Key: ark:/67531/metadc709345

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  • August 1, 1998

Added to The UNT Digital Library

  • Sept. 12, 2015, 6:31 a.m.

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  • April 14, 2016, 7:28 p.m.

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Sniegowski, J.J. Chemical mechanical polishing: An enabling fabrication process for surface micromachining technologies, article, August 1, 1998; Albuquerque, New Mexico. (digital.library.unt.edu/ark:/67531/metadc709345/: accessed August 22, 2017), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.