Prediction of Tungsten CMP Pad Life Using Blanket Removal Rate Data and Endpoint Data Obtained from Process Temperature and Carrier Motor Current Measurments

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Description

Several techniques to predict pad failure during tungsten CMP were investigated for a specific consumable set. These techniques include blanket polish rate measurements and metrics derived from two endpoint detection schemes. Blanket polish rate decreased significantly near pad failure. Metrics from the thermal endpoint technique included change in peak temperature, change in the time to reach peak temperature, and the change in the slope of the temperature trace just prior to peak temperature all as a function of pad life. Average carrier motor current before endpoint was also investigated. Changes in these metrics were observed however these changes, excluding time ... continued below

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8 Pages

Creation Information

Hetherington, Dale L. & Stein, David J. May 14, 1999.

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This article is part of the collection entitled: Office of Scientific & Technical Information Technical Reports and was provided by UNT Libraries Government Documents Department to Digital Library, a digital repository hosted by the UNT Libraries. It has been viewed 29 times , with 5 in the last month . More information about this article can be viewed below.

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  • Sandia National Laboratories
    Publisher Info: Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA
    Place of Publication: Albuquerque, New Mexico

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Description

Several techniques to predict pad failure during tungsten CMP were investigated for a specific consumable set. These techniques include blanket polish rate measurements and metrics derived from two endpoint detection schemes. Blanket polish rate decreased significantly near pad failure. Metrics from the thermal endpoint technique included change in peak temperature, change in the time to reach peak temperature, and the change in the slope of the temperature trace just prior to peak temperature all as a function of pad life. Average carrier motor current before endpoint was also investigated. Changes in these metrics were observed however these changes, excluding time to peak process temperature, were either not consistent between pads or too noisy to be reliable predictors of pad failure.

Physical Description

8 Pages

Source

  • SPIE Symposium on Microelectronics Manufacturing Technologies; Edinburgh, Scotland; 05/19-21/1999

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  • Other: DE00007242
  • Report No.: SAND99-1181C
  • Grant Number: AC04-94AL85000
  • Office of Scientific & Technical Information Report Number: 7242
  • Archival Resource Key: ark:/67531/metadc706905

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Creation Date

  • May 14, 1999

Added to The UNT Digital Library

  • Sept. 12, 2015, 6:31 a.m.

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  • Dec. 6, 2016, 4:19 p.m.

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Hetherington, Dale L. & Stein, David J. Prediction of Tungsten CMP Pad Life Using Blanket Removal Rate Data and Endpoint Data Obtained from Process Temperature and Carrier Motor Current Measurments, article, May 14, 1999; Albuquerque, New Mexico. (digital.library.unt.edu/ark:/67531/metadc706905/: accessed September 21, 2017), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.