Ultrasonic evaluation of beryllium-copper diffusion bonds

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Description

A study was performed to compare the effectiveness of several advanced ultrasonic techniques when used to determine the strength of diffusion bonded beryllium-copper, which heretofore have each been applied to only a few material systems. The use of integrated backscatter calculations, frequency domain reflection coefficients, and time-of-flight variance was compared in their ability to characterize the bond strength in a series of beryllium-copper diffusion bond samples having a wide variation in bond quality. Correlation of integrated backscatter calculations and time-of-flight variance with bond strength was good. Some correlation of the slope of the frequency based reflection coefficient was shown for ... continued below

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71 pages

Creation Information

Jamieson, E.E. June 8, 2000.

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This report is part of the collection entitled: Office of Scientific & Technical Information Technical Reports and was provided by UNT Libraries Government Documents Department to Digital Library, a digital repository hosted by the UNT Libraries. More information about this report can be viewed below.

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  • Kansas City Plant (U.S.)
    Publisher Info: Kansas City Plant, Kansas City, MO (United States)
    Place of Publication: Kansas City, Missouri

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Description

A study was performed to compare the effectiveness of several advanced ultrasonic techniques when used to determine the strength of diffusion bonded beryllium-copper, which heretofore have each been applied to only a few material systems. The use of integrated backscatter calculations, frequency domain reflection coefficients, and time-of-flight variance was compared in their ability to characterize the bond strength in a series of beryllium-copper diffusion bond samples having a wide variation in bond quality. Correlation of integrated backscatter calculations and time-of-flight variance with bond strength was good. Some correlation of the slope of the frequency based reflection coefficient was shown for medium and high strength bonds, while its Y-intercept showed moderate correlation for all bond strengths.

Physical Description

71 pages

Notes

OSTI as DE00756292

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  • Other Information: PBD: 8 Jun 2000

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  • Report No.: KCP-613-6332
  • Grant Number: AC04-76DP00613
  • DOI: 10.2172/756292 | External Link
  • Office of Scientific & Technical Information Report Number: 756292
  • Archival Resource Key: ark:/67531/metadc706415

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Creation Date

  • June 8, 2000

Added to The UNT Digital Library

  • Sept. 12, 2015, 6:31 a.m.

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  • Feb. 20, 2017, 7:14 p.m.

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Jamieson, E.E. Ultrasonic evaluation of beryllium-copper diffusion bonds, report, June 8, 2000; Kansas City, Missouri. (digital.library.unt.edu/ark:/67531/metadc706415/: accessed September 22, 2017), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.