Effect of interface microstructure on the mechanical properties of Pb-free hybrid microcircuit solder joints

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Description

Although Sn-Pb eutectic alloy is widely used as a joining material in the electronics industry, it has well documented environmental and toxicity issues. Sandia National Laboratories is developing alternative solder materials to replace traditional Pb-containing alloys. The alloys are based on the Sn-Ag, Sn-Ag-Bi and Sn-Ag-Bi-Au systems. Prototype hybrid microcircuit (HMC) test vehicles have been developed to evaluate these Pb-free solders, using Au-Pt-Pd thick film metallization. Populated test vehicles with surface mount devices have been designed and fabricated to evaluate the reliability of surface mount solder joints. The test components consist of a variety of dummy chip capacitors and leadless ... continued below

Physical Description

8 p.

Creation Information

Hernandez, C.L.; Vianco, P.T. & Rejent, J.A. August 1, 1998.

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This report is part of the collection entitled: Office of Scientific & Technical Information Technical Reports and was provided by UNT Libraries Government Documents Department to Digital Library, a digital repository hosted by the UNT Libraries. More information about this report can be viewed below.

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  • Sandia National Laboratories
    Publisher Info: Sandia National Labs., Albuquerque, NM (United States)
    Place of Publication: Albuquerque, New Mexico

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Description

Although Sn-Pb eutectic alloy is widely used as a joining material in the electronics industry, it has well documented environmental and toxicity issues. Sandia National Laboratories is developing alternative solder materials to replace traditional Pb-containing alloys. The alloys are based on the Sn-Ag, Sn-Ag-Bi and Sn-Ag-Bi-Au systems. Prototype hybrid microcircuit (HMC) test vehicles have been developed to evaluate these Pb-free solders, using Au-Pt-Pd thick film metallization. Populated test vehicles with surface mount devices have been designed and fabricated to evaluate the reliability of surface mount solder joints. The test components consist of a variety of dummy chip capacitors and leadless ceramic chip carriers (LCCC`s). Intermetallic compound (IMC) layer reaction products that form at the solder/substrate interface have been characterized and their respective growth kinetics quantified. Thicker IMC layers pose a potential reliability problem with solder joint integrity. Since the IMC layer is brittle, the likelihood of mechanical failure of a joint in service is increased. The effect of microstructure and the response of these different materials to wetting, aging and mechanical testing was also investigated. Solid-state reaction data for intermetallic formation and mechanical properties of the solder joints are reported.

Physical Description

8 p.

Notes

OSTI as DE98006146

Source

  • Institute for Interconnecting and Packaging Electronics Circuits/Surface Mount Technology Association electronics assembly expo, Providence, RI (United States), 27-29 Oct 1998

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Identifier

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  • Other: DE98006146
  • Report No.: SAND--98-1438C
  • Report No.: CONF-981022--
  • Grant Number: AC04-94AL85000
  • DOI: 10.2172/676869 | External Link
  • Office of Scientific & Technical Information Report Number: 676869
  • Archival Resource Key: ark:/67531/metadc706357

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  • August 1, 1998

Added to The UNT Digital Library

  • Sept. 12, 2015, 6:31 a.m.

Description Last Updated

  • April 14, 2016, 7:37 p.m.

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Hernandez, C.L.; Vianco, P.T. & Rejent, J.A. Effect of interface microstructure on the mechanical properties of Pb-free hybrid microcircuit solder joints, report, August 1, 1998; Albuquerque, New Mexico. (digital.library.unt.edu/ark:/67531/metadc706357/: accessed August 17, 2017), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.